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SN74LVC1G98_10

更新时间： 2024-11-04 11:51:59
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CONFIGURABLE MULTIPLE-FUNCTION GATE

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SN74LVC1G98_10 数据手册

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SN74LVC1G98  
CONFIGURABLE MULTIPLE-FUNCTION GATE  
www.ti.com  
SCES417J–DECEMBER 2002–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
•
•
•
•
•
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6.3 ns at 3.3 V  
ESD Protection Exceeds JESD 22  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
4
Y
V
In0  
GND  
In1  
1
2
3
6
In1  
GND  
In0  
In2  
In1  
GND  
In0  
In2  
V
1
2
3
6
1
2
3
6
In1  
GND  
In0  
In2  
V
2 5  
CC  
5
4
CC  
V
Y
5
4
CC  
1
6
In2  
Y
CC  
5
4
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of  
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All  
inputs can be connected to VCC or GND.  
This device functions as an independent gate, but because of Schmitt action, it may have different input  
threshold levels for positive-going (VT+) and negative-going (VT–) signals.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000 SN74LVC1G98YZPR  
_ _ _CW_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000 SN74LVC1G98DBVR  
Reel of 250 SN74LVC1G98DBVT  
Reel of 3000 SN74LVC1G98DCKR  
Reel of 250 SN74LVC1G98DCKT  
Reel of 4000 SN74LVC1G98DRLR  
C98_  
–40°C to 85°C  
SOT (SC-70) – DCK  
CW_  
CW_  
SOT (SOT-563) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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