SN74LVC1G98
CONFIGURABLE MULTIPLE-FUNCTION GATE
www.ti.com
SCES417H–DECEMBER 2002–REVISED JUNE 2005
FEATURES
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
•
•
•
•
Supports 5-V VCC Operation
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Inputs Accept Voltages to 5.5 V
Max tpd of 6.3 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
YEA, YEP, YZA,
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
OR YZP PACKAGE
(BOTTOM VIEW)
3
4
Y
V
In0
GND
In1
1
2
3
6
In1
GND
In0
In2
V
In1
GND
In0
In2
V
1
2
3
6
1
2
3
6
In1
GND
In0
In2
V
2 5
CC
5
4
CC
5
4
CC
1
6
In2
Y
CC
5
4
Y
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to VCC or GND.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC1G98YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
SN74LVC1G98YZAR
SN74LVC1G98YEPR
SN74LVC1G98YZPR
Reel of 3000
_ _ _CW_
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
Reel of 3000 SN74LVC1G98DBVR
Reel of 250 SN74LVC1G98DBVT
Reel of 3000 SN74LVC1G98DCKR
Reel of 250 SN74LVC1G98DCKT
Reel of 4000 SN74LVC1G98DRLR
SOT (SOT-23) – DBV
C98_
SOT (SC-70) – DCK
CW_
CW_
SOT (SOT-553) – DRL
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.