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SCES609B − SEPTEMBER 2004 – REVISED JANUARY 2005
DCT OR DCU PACKAGE
(TOP VIEW)
D
Available in Texas Instruments NanoStar
and NanoFree Packages
D
D
D
D
D
D
Supports 5-V V
Operation
CC
OE
A
B
V
Y
D
C
1
2
3
4
8
7
6
5
CC
Inputs Accept Voltages to 5.5 V
Max t of 6.7 ns at 3.3 V
pd
Low Power Consumption, 10-µA Max I
GND
CC
24-mA Output Drive at 3.3 V
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Offers Nine Different Logic Functions in a
Single Package
4 5
3 6
2 7
1 8
GND
B
A
OE
C
D
Y
D
D
I
Supports Partial-Power-Down Mode
off
Operation
Input Hysteresis Allows for Slow Input
Transition Time and Better Noise Immunity
at Input
V
CC
D
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The SN74LVC1G99 is operational from 1.65 V to 5.5 V.
The SN74LVC1G99 features configurable multiple functions with a 3-state output. The output is disabled when
the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input.
The user can choose logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer.
All inputs can be connected to V
or GND.
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
SN74LVC1G99YEPR
SN74LVC1G99YZPR
Reel of 3000
DE_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
−40°C to 85°C
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC1G99DCTR
SN74LVC1G99DCTT
SN74LVC1G99DCUR
SSOP − DCT
C99_ _ _
C99_
VSSOP − DCU
Reel of 250
SN74LVC1G99DCUT
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin
1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2005, Texas Instruments Incorporated
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ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265