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SN74LVC1GX04_15

更新时间： 2024-11-25 02:58:15
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德州仪器 - TI /
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19页 718K
描述
Crystal Oscillator Driver

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SN74LVC1GX04_15 数据手册

 浏览型号SN74LVC1GX04_15的Datasheet PDF文件第2页浏览型号SN74LVC1GX04_15的Datasheet PDF文件第3页浏览型号SN74LVC1GX04_15的Datasheet PDF文件第4页浏览型号SN74LVC1GX04_15的Datasheet PDF文件第5页浏览型号SN74LVC1GX04_15的Datasheet PDF文件第6页浏览型号SN74LVC1GX04_15的Datasheet PDF文件第7页 
SN74LVC1GX04  
CRYSTAL OSCILLATOR DRIVER  
www.ti.com  
SCES581B–JULY 2004–REVISED DECEMBER 2006  
FEATURES  
•
Available in Texas Instruments NanoStar™  
and NanoFree™ Packages  
•
•
±24-mA Output Drive at 3.3 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
•
•
•
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
One Unbuffered Inverter (SN74LVC1GU04)  
and One Buffered Inverter (SN74LVC1G04)  
ESD Protection Exceeds JESD 22  
•
Suitable for Commonly Used Clock  
Frequencies:  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
–
15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,  
25 MHz, 26 MHz, 27 MHz, 28 MHz  
1000-V Charged-Device Model (C101)  
•
•
Max tpd of 2.4 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YEP ORYZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
5
X1  
GND  
DNU  
X2  
VCC  
Y
Y
1
2
3
6
5
4
Y
1
2
3
6
5
4
NC  
GND  
X1  
NC  
GND  
X1  
Y
1
2
3
6
5
4
NC  
GND  
X1  
VCC  
X2  
VCC  
VCC  
X2  
X2  
See mechanical drawings for dimensions.  
NC – No internal connection  
DNU – Do not use  
DESCRIPTION/ORDERING INFORMATION  
The SN74LVC1GX04 is designed for 1.65-V to 5.5-V VCC operation. This device incorporates the  
SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single  
device. The LVC1GX04 is optimized for use in crystal oscillator applications.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1GX04YEPR(3)  
SN74LVC1GX04YZPR(3)  
PREVIEW  
PREVIEW  
Reel of 3000  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
Reel of 3000 SN74LVC1GX04DBVR  
Reel of 250 SN74LVC1GX04DBVT  
Reel of 3000 SN74LVC1GX04DCKR  
Reel of 250 SN74LVC1GX04DCKT  
Reel of 4000 SN74LVC1GX04DRLR  
–40°C to 85°C  
SOT (SOT-23) – DBV  
CX4_  
SOT (SC-70) – DCK  
D2_  
UC_  
SOT (SOT-553) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
(3) Package preview  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 2004–2006, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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