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SN74LVC1GX04YZPR PDF预览

SN74LVC1GX04YZPR

更新时间： 2024-11-23 22:09:47
品牌 Logo 应用领域
德州仪器 - TI 振荡器晶体振荡器驱动器栅极逻辑集成电路
页数 文件大小 规格书
13页 300K
描述
CRYSTAL OSCILLATOR DRIVER

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SN74LVC1GX04YZPR 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：LEAD FREE, DSBGA-6
针数：6Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.7
Is Samacsys：N系列：LVC/LCX/Z
JESD-30 代码：R-XBGA-B6长度：1.4 mm
逻辑集成电路类型：INVERTER/BUFFER功能数量：1
输入次数：1端子数量：6
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装代码：VFBGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED传播延迟（tpd）：18 ns
认证状态：Not Qualified座面最大高度：0.5 mm
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：1.65 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：0.9 mmBase Number Matches：1

SN74LVC1GX04YZPR 数据手册

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SCES581 − JULY 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in Texas Instruments NanoStar  
and NanoFreePackages  
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
NC  
GND  
X1  
Y
V
X2  
Inputs Accept Voltages to 5.5 V  
CC  
One Unbuffered Inverter (SN74LVC1GU04)  
and One Buffered Inverter (SN74LVC1G04)  
NC − No internal connection  
D
Suitable for Commonly Used Clock  
Frequencies:  
− 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,  
25 MHz, 26 MHz, 27 MHz, 28 MHz  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
3 4  
2 5  
1 6  
X1  
GND  
DNU  
X2  
D
D
D
D
Max t of 2.4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
V
Y
CC  
CC  
24-mA Output Drive at 3.3 V  
DNU − Do not use  
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
D
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
The SN74LVC1GX04 is designed for 1.65-V to 5.5-V V  
operation. This device incorporates the  
CC  
SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single  
device. The LVC1GX04 is optimized for use in crystal oscillator applications.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1GX04YEPR  
SN74LVC1GX04YZPR  
Reel of 3000  
_ _ _ _  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1GX04DBVR  
SN74LVC1GX04DBVT  
SN74LVC1GX04DCKR  
SOT (SOT-23) − DBV  
CX4_  
D2_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1GX04DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...13

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