SN74LVC1G97-Q1
www.ti.com ........................................................................................................................................................ SCES561D–MARCH 2004–REVISED APRIL 2008
CONFIGURABLE MULTIPLE-FUNCTION GATE
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FEATURES
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•
•
•
•
•
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Qualified for Automotive Applications
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Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Supports 5-V VCC Operation
ESD Protection Exceeds JESD 22
Inputs Accept Voltages to 5.5 V
Max tpd of 7.3 ns at 3.3 V
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–
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2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
1000-V Charged-Device Model (C101)
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Choose From Nine Specific Logic Functions
Ioff Supports Partial-Power-Down Mode
Operation
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
In1
GND
In0
In2
1
2
3
6
5
4
In1
GND
In0
In2
VCC
VCC
Y
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to VCC or GND.
This device functions as an independent gate but, because of Schmitt action, it may have different input
threshold levels for positive-going (VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
SN74LVC1G97QDBVRQ1
SN74LVC1G97QDCKRQ1
TOP-SIDE MARKING(3)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
Reel of 3000
Reel of 3000
C97_
CS_
–40°C to 125°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.