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SN74LVC1G97-Q1 PDF预览

SN74LVC1G97-Q1

更新时间: 2024-11-04 11:58:31
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德州仪器 - TI
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描述
CONFIGURABLE MULTIPLE-FUNCTION GATE

SN74LVC1G97-Q1 数据手册

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SN74LVC1G97-Q1  
www.ti.com ........................................................................................................................................................ SCES561DMARCH 2004REVISED APRIL 2008  
CONFIGURABLE MULTIPLE-FUNCTION GATE  
1
FEATURES  
Qualified for Automotive Applications  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Supports 5-V VCC Operation  
ESD Protection Exceeds JESD 22  
Inputs Accept Voltages to 5.5 V  
Max tpd of 7.3 ns at 3.3 V  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Choose From Nine Specific Logic Functions  
Ioff Supports Partial-Power-Down Mode  
Operation  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
In1  
GND  
In0  
In2  
1
2
3
6
5
4
In1  
GND  
In0  
In2  
VCC  
VCC  
Y
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of  
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All  
inputs can be connected to VCC or GND.  
This device functions as an independent gate but, because of Schmitt action, it may have different input  
threshold levels for positive-going (VT+) and negative-going (VT–) signals.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
SN74LVC1G97QDBVRQ1  
SN74LVC1G97QDCKRQ1  
TOP-SIDE MARKING(3)  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
C97_  
CS_  
–40°C to 125°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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