Datasheet > 逻辑 > 触发器/锁存器> SN74LVC1G175-EP

SN74LVC1G175-EP

更新时间： 2024-11-18 12:47:03

品牌	Logo	应用领域
德州仪器 - TI		触发器
页数	文件大小	规格书
14页	545K
描述
SINGLE D-TYPE FLIP-FLOP WITH ASYNCHRONOUS CLEAR

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SN74LVC1G175-EP 数据手册

SN74LVC1G175-EP

www.ti.com

SGLS366A –AUGUST 2006–REVISED DECEMBER 2010

SINGLE D-TYPE FLIP-FLOP

WITH ASYNCHRONOUS CLEAR

Check for Samples: SN74LVC1G175-EP

FEATURES

•

Supports 5-V V_CCOperation

SUPPORTS DEFENSE, AEROSPACE,

AND MEDICAL APPLICATIONS

Inputs Accept Voltages to 5.5 V

Max t_pdof 4.3 ns at 3.3 V

•

Controlled Baseline

One Assembly/Test Site

One Fabrication Site

Available in Military (–55°C/125°C)

Temperature Range⁽¹⁾

Low Power Consumption, 10-mA Max I_CC

±24-mA Output Drive at 3.3 V

I_offSupports Partial Power-Down-Mode

Operation

•

Extended Product Life Cycle

Extended Product-Change Notification

Product Traceability

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

ESD Protection Exceeds JESD 22

DCK PACKAGE

(TOP VIEW)

–

2000-V Human-Body Model (A114-A)

200-V Machine Model (A115-A)

1000-V Charged-Device Model (C101)

CLK

GND

CLR

V_CC

(1) Additional temperature ranges available - contact factory

DESCRIPTION/ORDERING INFORMATION

This single D-type flip-flop is designed for 1.65-V to 5.5-V V_CCoperation.

The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is

transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low

state, regardless of the clock edge or data on D.

This device is fully specified for partial-power-down applications using I_off. The I_offcircuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION⁽¹⁾

T_A

PACKAGE⁽²⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING⁽³⁾

–55°C to 125°C

SOT (SC-70) – DCK

Reel of 3000

CLVC1G175MDCKREP

BUD

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(3) The actual top-side marking has one additional character that designates the assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...14

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