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SN74LVC1G17MDBVREP PDF预览

SN74LVC1G17MDBVREP

更新时间: 2024-11-18 12:47:03
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德州仪器 - TI /
页数 文件大小 规格书
15页 503K
描述
SINGLE SCHMITT-TRIGGER BUFFER

SN74LVC1G17MDBVREP 数据手册

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SN74LVC1G17-EP  
www.ti.com  
SGLS336AAPRIL 2006REVISED JUNE 2007  
SINGLE SCHMITT-TRIGGER BUFFER  
FEATURES  
ESD Protection Exceeds JESD 22  
Controlled Baseline  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
One Assembly/Test Site, One Fabrication  
Site  
1000-V Charged-Device Model (C101)  
(1)  
Extended Temperature Performance of –55°C  
to 125°C  
Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Qualification Pedigree(1)  
Supports 5-V VCC Operation  
Max tpd of 4.6 ns at 3.3 V  
DCK PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
Low Power Consumption, 10 μA Max ICC  
±24 mA Output Drive at 3.3 V  
NC  
VCC  
1
2
3
5
1
2
3
5
VCC  
NC  
A
Ioff Supports Partial Power Down Mode  
Operation  
A
4
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
GND  
Y
4
Y
GND  
DESCRIPTION/ORDERING INFORMATION  
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an  
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going  
(VT+) and negative-going (VT–) signals.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
SOT (SC-70) - DCK  
SOP (SOT-23) - DBV  
ORDERABLE PART NUMBER  
SN74LVC1G17MDCKREP  
SN74LVC1G17MDBVREP  
TOP-SIDE MARKING  
Reel of 3000  
Reel of 3000  
C70  
–55°C to 125°C  
C170  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
INPUT A  
OUTPUT Y  
H
L
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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