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SCDS025R − MAY 1995 − REVISED JANUARY 2004
D
D
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
D
Designed to Be Used in Level-Shifting
Applications
SN54CBTD3384 . . . JT OR W PACKAGE
SN54CBTD3384 . . . FK PACKAGE
(TOP VIEW)
SN74CBTD3384 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
V
CC
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
4
3
2 1 28 27 26
5
6
7
8
9
25
24
23
22
21
20
19
1A2
1B2
1B3
NC
2A4
2B4
2B3
NC
1A3
1A4
1B4
2A3
2A2
2B2
10
11
12 13 14 15 16 17 18
1B5 10
15 2B1
1A5
GND
2A1
2OE
11
12
14
13
NC − No internal connection
description/ordering information
The ’CBTD3384 devices provide ten bits of high-speed TTL-compatible bus switching. The low on-state
resistance of the switches allows connections to be made without adding propagation delay. A diode to V is
CC
integrated on the die to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device
outputs.
These devices are organized as two 5-bit switches with separate output-enable (OE) inputs. When OE is low,
the switch is on, and port A is connected to port B. When OE is high, the switch is open, and the high-impedance
state exists between the two ports.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN74CBTD3384DW
SN74CBTD3384DWR
SN74CBTD3384DBR
SN74CBTD3384DBQR
SN74CBTD3384PW
SN74CBTD3384PWR
SN74CBTD3384DGVR
SNJ54CBTD3384JT
SNJ54CBTD3384W
SNJ54CBTD3384FK
SOIC − DW
SSOP − DB
CBTD3384
Tape and reel
Tape and reel
CC384
SSOP (QSOP) − DBQ Tape and reel
Tube
CBTD3384
−40°C to 85°C
TSSOP − PW
CC384
Tape and reel
TVSOP − DGV
CDIP − JT
Tape and reel
Tube
CC384
SNJ54CBTD3384JT
SNJ54CBTD3384W
SNJ54CBTD3384FK
CFP − W
Tube
−55°C to 125°C
LCCC − FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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