Datasheet > SN74AUP1G07_10

SN74AUP1G07_10

更新时间： 2024-11-02 09:15:19

品牌	Logo	应用领域
德州仪器 - TI		驱动器输出元件
页数	文件大小	规格书
21页	975K
描述
LOW-POWER SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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SN74AUP1G07_10 数据手册

SN74AUP1G07

www.ti.com

SCES591F –JULY 2004–REVISED MAY 2010

LOW-POWER SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

Check for Samples: SN74AUP1G07

FEATURES

•

Available in the Texas Instruments NanoStar™

Package

•

Wide Operating V_CCRange of 0.8 V to 3.6 V

Optimized for 3.3-V Operation

Low Static-Power Consumption

(I_CC= 0.9 mA Maximum)

3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

Low Dynamic-Power Consumption

(C_pd= 1 pF Typical at 3.3 V)

•

t_pd= 3.3 ns Maximum at 3.3 V

Suitable for Point-to-Point Applications

•

Low Input Capacitance (C_i= 1.5 pF Typical)

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

Low Noise – Overshoot and Undershoot

<10% of V_CC

•

ESD Performance Tested Per JESD 22

•

I_offSupports Partial-Power-Down Mode

Operation

–

2000-V Human-Body Model

(A114-B, Class II)

Input Hysteresis Allows Slow Input Transition

and Better Switching Noise Immunity at the

Input (V_hys= 250 mV Typ at 3.3 V)

–

1000-V Charged-Device Model (C101)

DBV PACKAGE

(TOP VIEW)

DCK PACKAGE

(TOP VIEW)

DRL PACKAGE

(TOP VIEW)

N.C.

V_CC

N.C.

V_CC

N.C.

V_CC

GND

DSF PACKAGE

(TOP VIEW)

YFP PACKAGE

(TOP VIEW)

YZP PACKAGE

(TOP VIEW)

DRY PACKAGE

(TOP VIEW)

N.C.

V_CC

N.C.

V_CC

DNU

V_CC

N.C.

V_CC

N.C.

GND ^B1

C1 3

GND

N.C. – No internal connection.

DNU – Do not use

See mechancial drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low power needs in battery-powered portable

applications. This family ensures a very low static and dynamic power consumption across the entire V_CCrange

of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see

Figure 1 and Figure 2).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...21

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