生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 针数: | 18 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.02 | 风险等级: | 5.84 |
Is Samacsys: | N | 访问模式: | FAST PAGE |
最长访问时间: | 150 ns | 其他特性: | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码: | R-CDIP-T18 | 长度: | 22.606 mm |
内存密度: | 1048576 bit | 内存集成电路类型: | FAST PAGE DRAM |
内存宽度: | 1 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 18 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 1MX1 |
输出特性: | 3-STATE | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 认证状态: | Not Qualified |
刷新周期: | 512 | 座面最大高度: | 4.45 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 宽度: | 7.62 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SMJ4C1024-15JDM | TI |
获取价格 |
1MX1 FAST PAGE DRAM, 150ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | |
SMJ4C1024-15SV | TI |
获取价格 |
1048576 BY 1-BIT DYNAMIC RANDOM-ACCESS MEMORY | |
SMJ4C1024-15SVM | TI |
获取价格 |
1MX1 FAST PAGE DRAM, 150ns, CDIP20, CERAMIC, DIP-20 | |
SMJ4C1024-80FQ | TI |
获取价格 |
1048576 BY 1-BIT DYNAMIC RANDOM-ACCESS MEMORY | |
SMJ4C1024-80FQMT | TI |
获取价格 |
1MX1 FAST PAGE DRAM, 80ns, CDSO20, CERAMIC, LCC-20 | |
SMJ4C1024-80HJ | TI |
获取价格 |
1048576 BY 1-BIT DYNAMIC RANDOM-ACCESS MEMORY | |
SMJ4C1024-80HK | TI |
获取价格 |
1048576 BY 1-BIT DYNAMIC RANDOM-ACCESS MEMORY | |
SMJ4C1024-80HKM | TI |
获取价格 |
1MX1 FAST PAGE DRAM, 80ns, CDFP20, CERAMIC, DFP-20 | |
SMJ4C1024-80HL | TI |
获取价格 |
1048576 BY 1-BIT DYNAMIC RANDOM-ACCESS MEMORY | |
SMJ4C1024-80HLM | TI |
获取价格 |
暂无描述 |