SMJ4C1024
1048576 BY 1-BIT
DYNAMIC RANDOM-ACCESS MEMORY
SGMS023E – DECEMBER 1988 – REVISED MARCH 1996
HJ PACKAGE
(TOP VIEW)
JD PACKAGE
(TOP VIEW)
Organization . . . 1048576 × 1-Bit
Processed to MIL-STD-883, Class B
Single 5-V Supply (10% Tolerance)
D
W
RAS
TF
1
2
3
4
5
20
19
18
17
16
V
SS
Q
CAS
NC
A9
D
W
RAS
TF
A0
A1
V
SS
Q
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
Performance Ranges:
CAS
A9
A8
A7
A6
A5
A4
ACCESS ACCESS ACCESS
READ
OR
WRITE
CYCLE
(MIN)
TIME
TIME
TIME
NC
t
t
t
a(R)
a(C)
a(CA)
(t
(t
RAC
)
(t
CAC
)
)
AA
(MAX)
(MAX)
(MAX)
A2
A3
A0
A1
A2
A3
6
15
14
13
12
11
A8
A7
A6
A5
A4
’4C1024-80
’4C1024-10
’4C1024-12
’4C1024-15
80 ns
100 ns
120 ns
150 ns
20 ns
25 ns
30 ns
40 ns
40 ns
45 ns
55 ns
70 ns
150 ns
190 ns
220 ns
260 ns
7
V
CC
8
9
Enhanced Page-Mode Operation for Faster
Memory Access
– Higher Data Bandwidth Than
Conventional Page Mode Parts
– Random Single-Bit Access Within a Row
With a Column Address
V
10
CC
HK PACKAGE
(TOP VIEW)
V
D
W
RAS
TF
NC
A0
A1
A2
A3
1
20
19
18
17
16
15
14
13
12
11
SS
Q
2
CAS
NC
A9
A8
A7
A6
A5
A4
3
One of TI’s CMOS Megabit Dynamic
Random-Access Memory (DRAM) Family
Including SMJ44C256 — 256K × 4
Enhanced Page Mode
4
5
6
7
CAS-Before-RAS (CBR) Refresh
8
9
Long Refresh Period
V
10
CC
512-Cycle Refresh in 8 ms (Max)
3-State Unlatched Output
Low Power Dissipation
FQ/HL PACKAGES
(TOP VIEW)
SV PACKAGE
(SIDE VIEW)
A9
Q
D
RAS
NC
A0
D
W
RAS
TF
10 11
V
SS
Q
CAS
NC
A9
1
All Inputs/Outputs and Clocks Are
TTL-Compatible
CAS
2
4
9
8
7
6
12
13
14
15
3
V
SS
5
Packaging Offered:
– 20/26-Pin J-Leaded Ceramic Surface
Mount Package (HJ Suffix)
– 18-Pin 300-Mil Ceramic Dual-In-Line
Package (JD Suffix)
– 20-Pin Ceramic Flatpack (HK Suffix)
– 20/26-Terminal Leadless Ceramic
Surface Mount Package (FQ/HL Suffixes)
– 20-Pin Ceramic Zig-Zag In-Line Package
(SV Suffix)
W
6
7
TF
NC
A1
A3
A4
A6
A8
8
NC
9
10
12
14
16
18
20
11
13
15
17
19
A2
V
CC
A5
A7
A0
A1
A2
A3
5
4
3
2
1
16
17
18
19
20
A8
A7
A6
A5
A4
V
CC
Operating Temperature Range
– 55°C to 125°C
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
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