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SLP_F16N65S PDF预览

SLP_F16N65S

更新时间: 2024-11-21 18:09:23
品牌 Logo 应用领域
美浦森 - Maplesemi /
页数 文件大小 规格书
9页 1193K
描述
TO-220C&TO-220F

SLP_F16N65S 数据手册

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SLP16N65S / SLF16N65S  
650V N-channel MOSFET  
General Description  
Features  
This Power MOSFET is produced using Msemitek‘s  
advanced planar stripe DMOS technology.  
- 16A, 650V, RDS(on)typ= 0.410Ω@VGS = 10 V  
- Low gate charge ( typical 35nC)  
- LowCrss ( typica5.5pF)  
- Fast switching  
- 100% avalanche tested  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction based on half bridge topology.  
- Improved dv/dt capability  
D
G
TO-220C  
S
Absolute Maximum Ratings  
TC = 25°C unless otherwise noted  
Symbol  
Parameter  
SLP16N65S / SLF16N65S  
Units  
V
Drain-Source Voltage  
650  
16  
VDSS  
Drain Current  
- Continuous (TC = 25)  
A
ID  
- Continuous (TC = 100)  
10.0  
64  
A
(Note 1)  
IDM  
VGSS  
EAS  
IAR  
Drain Current  
- Pulsed  
A
Gate-Source Voltage  
30  
±
V
(Note 2)  
(Note 1)  
Single Pulsed Avalanche Energy  
Avalanche Current  
390  
mJ  
A
16  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25)  
51  
mJ  
V/ns  
W
AR  
(Note 3)  
dv/dt  
5
38  
PD  
- Derate above 25℃  
0.30  
W/℃  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum lead temperature for soldering purposes,  
1/8" from case for 5 seconds  
300  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
SLP16N65S / SLF16N65S  
Units  
/W  
/W  
/W  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
3.70  
--  
RθJC  
RθJS  
RθJA  
42.8  
Msemitek Co., Ltd  
http://www.msemitek.com  
Rev1.0 Apr. 2020  

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