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SLP_F5N65C

更新时间: 2024-11-21 18:09:51
品牌 Logo 应用领域
美浦森 - Maplesemi /
页数 文件大小 规格书
10页 1620K
描述
TO-220C&TO-220F

SLP_F5N65C 数据手册

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SLP5N65C / SLF5N65C  
650V N-Channel MOSFET  
General Description  
Features  
This Power MOSFET is produced using Msemitek‘s  
advanced planar stripe DMOS technology.  
- 4.5A, 650V, RDS(on) = 2.3Ω@VGS = 10 V  
- Low gate charge ( typical 16nC)  
- High ruggedness  
- Fast switching  
- 100% avalanche tested  
- Improved dv/dt capability  
This advanced technology has been especially tailored  
to minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction based on half bridge topology.  
D
G
TO-220C  
S
Absolute Maximum Ratings  
TC = 25°C unless otherwise noted  
Symbol  
Parameter  
SLP5N65C  
SLF5N65C  
Units  
V
Drain-Source Voltage  
650  
VDSS  
Drain Current  
- Continuous (TC = 25)  
4.5  
2.6  
18  
4.5 *  
2.6 *  
A
ID  
- Continuous (TC = 100)  
A
(Note 1)  
IDM  
VGSS  
EAS  
IAR  
Drain Current  
- Pulsed  
18 *  
A
Gate-Source Voltage  
30  
V
±
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
180  
4.5  
10  
mJ  
A
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25)  
mJ  
V/ns  
W
dv/dt  
4.5  
100  
0.8  
33  
PD  
- Derate above 25℃  
0.26  
W/℃  
TJ, TSTG  
Operating and Storage Temperature Range  
-55 to +150  
300  
Maximum lead temperature for soldering purposes,  
TL  
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
RθJC  
Parameter  
SLP5N65C  
1.25  
SLF5N65C  
Units  
/W  
/W  
/W  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
3.79  
--  
0.5  
RθJS  
62.5  
62.5  
RθJA  
Msemitek Co., Ltd  
http://www.msemitek.com  
Rev.1.1 October . 2018  

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*低插入力端子可减少表面光洁度磨损,减少应力松弛的影响。*塑壳锁扣方式*内部外壳锁将插头固