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SiRA12CDP PDF预览

SiRA12CDP

更新时间: 2024-11-22 14:55:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 192K
描述
N-Channel 30 V (D-S) MOSFET

SiRA12CDP 数据手册

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SiRA12CDP  
Vishay Siliconix  
www.vishay.com  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PowerPAK® SO-8 Single  
D
D
7
8
D
6
• 100 % Rg and UIS tested  
D
5
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
2
S
S
D
APPLICATIONS  
3
4
G
S
1
• High power density DC/DC  
• Synchronous rectification  
• Power conversion  
Top View  
Bottom View  
PRODUCT SUMMARY  
G
VDS (V)  
30  
• Load switch  
R
DS(on) max. () at VGS = 10 V  
DS(on) max. () at VGS = 4.5 V  
0.0033  
0.0055  
9.5  
R
S
Qg typ. (nC)  
D (A) a  
Configuration  
N-Channel MOSFET  
I
76.4  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8  
Lead (Pb)-free and halogen-free  
SiRA12CDP-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
30  
UNIT  
VDS  
V
VGS  
+20, -16  
76.4  
61.4  
24.8 b, c  
21.1 b, c  
150  
TC = 25 °C  
C = 70 °C  
T
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
31  
3.3 b, c  
20  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.3 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
20  
34.7  
22.2  
mJ  
W
TC = 70 °C  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
3.6 b, c  
2.3 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SMYBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
Maximum junction-to-ambient b, f  
t 10 s  
Steady state  
24  
34  
°C/W  
Maximum junction-to-case (drain)  
RthJC  
2.8  
3.6  
Notes  
a. Based on TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 70 °C/W  
S22-1037-Rev. A, 19-Dec-2022  
Document Number: 62156  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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