Datasheet > SiRA18BDP

SiRA18BDP

更新时间： 2024-11-22 14:53:11

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	241K
描述
N-Channel 30 V (D-S) MOSFET

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SiRA18BDP 数据手册

SiRA18BDP

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PowerPAK^®SO-8 Single

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• High power density DC/DC

• Synchronous rectification

• Power conversion

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

0.00683

0.01050

6.2

• Load switch

_DS(on)max. () at V_GS= 10 V

_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

_D(A) ^a

Configuration

N-Channel MOSFET

Single

ORDERING INFORMATION

Package

PowerPAK SO-8

Lead (Pb)-free and halogen-free

SiRA18BDP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

+20, -16

UNIT

V_DS

V_GS

T_C= 25 °C

_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

19 ^{b, c}

15 ^{b, c}

3.4 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

L = 0.3 mH

T_C= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

8.2

T_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

3.8 ^{b, c}

2.4 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

SMYBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

5.5

7.2

°C/W

Maximum junction-to-case (drain)

Notes

a. Based on T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S19-0498-Rev. A, 03-Jun-2019

Document Number: 77143

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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与SiRA18BDP相关器件

型号	品牌	获取价格	描述	数据表
SiRA18DP	VISHAY	获取价格	N-Channel 30 V (D-S) MOSFET
SiRA20BDP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SiRA20DP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SiRA22DP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SiRA24DP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SIRA24DP-T1-GE3	VISHAY	获取价格	Power Field-Effect Transistor,
SiRA26DP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SiRA28BDP	VISHAY	获取价格	N-Channel 30 V (D-S) MOSFET
SiRA32DP	VISHAY	获取价格	N-Channel 25 V (D-S) MOSFET
SIRA34DP-T1-GE3	VISHAY	获取价格	MOSFET N-CH 30V 40A PPAK SO-8

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