Datasheet > SIR330DP

SIR330DP

更新时间： 2024-11-18 09:25:03

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	508K
描述
N-Channel 30 V (D-S) MOSFET

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SIR330DP 数据手册

New Product

SiR330DP

Vishay Siliconix

N-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)()

Q_g(Typ.)

_D(A)^{a, g}

Definition

35^g

TrenchFET^®Power MOSFET

100 % R_gTested

100 % UIS Tested

0.0056 at V_GS= 10 V

0.0075 at V_GS= 4.5 V

•

11.2 nC

PowerPAK^®SO-8

• Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

•

Synchronous Buck Converter

- High-Side Switch

Notebook

6.15 mm

5.15 mm

•

Server

Bottom View

Ordering Information: SiR330DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

Unit

V_DS

Drain-Source Voltage

Gate-Source Voltage

V_GS

35^g

T_C= 25 °C

_C= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

22.2^{b, c}

T_A= 25 °C

T_A= 70 °C

17.8^{b, c}

I_DM

I_S

Pulsed Drain Current

35^g

4.5^{b, c}

_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

L =0.1 mH

T_C= 25 °C

I_AS

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

E_AS

27.7

T_C= 70 °C

17.7

P_D

Maximum Power Dissipation

5.0^{b, c}

3.2^{b, c}

T_A= 25 °C

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

Typical

Maximum

Unit

t  10 s

°C/W

Steady State

R_thJC

3.4

4.5

Notes:

a. Based on T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 70 °C/W.

g. Package limited.

Document Number: 67089

S10-2604-Rev. A, 15-Nov-10

www.vishay.com

12 3 4 5 6 7...13

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