SiE822DF
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
ID (A)a
Definition
TrenchFET® Power MOSFET
Ultra Low Thermal Resistance Using Top-
Exposed PolarPAK® Package for Double-
Sided Cooling
Silicon Package
•
•
VDS (V)
RDS(on) (Ω)
Qg (Typ.)
Limit
Limit
0.0034 at V = 10 V
GS
138
50
20
24 nC
0.0055 at V = 4.5 V
GS
108
50
•
Leadframe-Based New Encapsulated Package
- Die Not Exposed
Package Drawing
www.vishay.com/doc?73398
- Same Layout Regardless of Die Size
Low Qgd/Qgs Ratio Helps Prevent Shoot-Through
100 % Rg and UIS Tested
•
•
•
PolarPAK
10
D
9
G
8
S
7
S
6
D
Compliant to RoHS directive 2002/95/EC
6
7
S
4
8
9
10
D
APPLICATIONS
D
•
•
•
VRM
DC-DC Conversion
Synchronous Rectification
D
D
G
G
D
1
G
2
S
3
S
4
D
5
5
3
2
1
S
Top View
Top surface is connected to pins 1, 5, 6, and 10
Ordering Information: SiE822DF-T1-E3 (Lead (Pb)-free)
SiE822DF-T1-GE3 (Lead (Pb)-free and Halogen-free)
Bottom View
N-Channel MOSFET
For Related Documents
www.vishay.com/ppg?74451
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
Unit
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
20
20
V
138 (Silicon Limit)
50a (Package Limit)
TC = 25 °C
50a
31b, c
24.8b, c
80
50a
4.3b, c
30
45
104
66
Continuous Drain Current (TJ = 150 °C)
ID
TC = 70 °C
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current
IDM
IS
T
C = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single Pulse Avalanche Current
Avalanche Energy
IAS
EAS
mJ
W
T
C = 70 °C
PD
Maximum Power Dissipation
5.2b, c
3.3b, c
TA = 25 °C
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
°C
260
Notes:
a. Package limited is 50 A.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 74451
S09-1338-Rev. B, 13-Jul-09
www.vishay.com
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