SiE830DF
Vishay Siliconix
New Product
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Extremely Low Qgd WFET® Technology for
ID (A)a
Low Switching Losses
RoHS
•
Ultra Low Thermal Resistance Using
Top-Exposed PolarPAK® Package for
Double-Sided Cooling
Leadframe-Based New Encapsulated Package
- Die Not Exposed
Silicon Package
COMPLIANT
VDS (V)
Qg (Typ)
rDS(on) (Ω)
Limit
Limit
0.0042 at V = 10 V
GS
120
50
•
30
33 nC
0.0048 at V = 4.5 V
GS
112
50
- Same Layout Regardless of Die Size
Package Drawing
•
•
Low Qgd/Qgs Ratio Helps Prevent Shoot-Through
100 % Rg and UIS Tested
PolarPAK
APPLICATIONS
10
D
9
G
8
S
7
S
6
D
6
7
S
4
8
9
10
D
•
•
•
VRM
Point-of-Load
Synchronous Rectification
D
D
G
D
D
1
G
2
S
3
S
4
D
5
5
3
2
1
G
Top View
Top surface is connected to pins 1, 5, 6, and 10
Bottom View
S
N-Channel MOSFET
Ordering Information: SiE830DF-T1-E3 (Lead (Pb)-free)
For Related Documents
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
Unit
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
30
12
V
120 (Silicon Limit)
50a (Package Limit)
TC = 25 °C
50a
27b, c
21.6b, c
80
Continuous Drain Current (TJ = 150 °C)
ID
TC = 70 °C
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current
IDM
IS
50a
TC = 25 °C
TA = 25 °C
Continuous Source-Drain Diode Current
4.3b, c
30
45
104
66
5.2b, c
3.3b, c
A
mJ
Single Pulse Avalanche Current
Avalanche Energy
IAS
EAS
T
C = 25 °C
T
T
C = 25 °C
C = 70 °C
PD
Maximum Power Dissipation
W
TA = 25 °C
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 50 to 150
260
°C
Notes:
a. Package limited is 50 A.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 sec.
d. See Solder Profile (http://www.vishay.com/doc?73257). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 74422
S-62482-Rev. A, 04-Dec-06
www.vishay.com
1