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Si8487DB PDF预览

Si8487DB

更新时间: 2024-11-25 14:52:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
11页 245K
描述
P-Channel 30 V (D-S) MOSFET

Si8487DB 数据手册

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Si8487DB  
Vishay Siliconix  
www.vishay.com  
P-Channel 30 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) () MAX.  
ID (A) a, e  
-7.7  
• Low-on resistance  
0.031 at VGS = -10 V  
0.035 at VGS = -4.5 V  
0.045 at VGS = -2.5 V  
• Ultra-small 1.6 mm x 1.6 mm maximum outline  
• Ultra-thin 0.6 mm maximum height  
• Pin compatible to Si8409DB  
-30  
-7.3  
-6.4  
MICRO FOOT® 1.6 x 1.6  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
2
D
3
S
APPLICATIONS  
8487  
xxx  
• Mobile computing, smart phones,  
tablet PCs  
1
G
4
S
- Load switch  
- Battery switch  
- Charger switch  
- OVP switch  
G
1
Backside View  
Bump Side View  
Marking Code: 8487  
Ordering Information:  
Si8487DB-T1-E1 (lead (Pb)-free and halogen-free)  
D
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-30  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
12  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
-7.7 a  
-6.2 a  
-4.9 b  
-4 b  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 300 μs)  
IDM  
IS  
-25  
TA = 25 °C  
TA = 25 °C  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
-2.3 a  
-0.92 b  
2.7 a  
1.8 a  
1.1 b  
0.73 b  
-55 to +150  
260  
Continuous Source-Drain Diode Current  
Maximum Power Dissipation  
PD  
W
Operating Junction and Storage Temperature Range  
Package Reflow Conditions c  
TJ, Tstg  
VPR  
°C  
IR / convection  
260  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient a, f  
Maximum Junction-to-Ambient b, g  
SYMBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
t = 5 s  
t = 5 s  
35  
85  
45  
°C/W  
RthJA  
110  
Notes  
a. Surface mounted on 1" x 1" FR4 board with full copper, t = 5 s.  
b. Surface mounted on 1" x 1" FR4 board with minimum copper, t = 5 s.  
c. Refer to IPC / JEDEC® (J-STD-020), no manual or hand soldering.  
d. In this document, any reference to case represents the body of the MICRO FOOT device and foot is the bump.  
e. Based on TA = 25 °C.  
f. Maximum under steady state conditions is 85 °C/W.  
g. Maximum under steady state conditions is 175 °C/W.  
S15-1692-Rev. E, 20-Jul-15  
Document Number: 63483  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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