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SI8489EDB-T2-E1 PDF预览

SI8489EDB-T2-E1

更新时间: 2024-11-24 21:13:55
品牌 Logo 应用领域
威世 - VISHAY 开关晶体管
页数 文件大小 规格书
8页 170K
描述
Small Signal Field-Effect Transistor, 20V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, 1 X 1 MM, 0.548 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, MICRO FOOT, 4 PIN

SI8489EDB-T2-E1 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:GRID ARRAY, S-PBGA-B4Reach Compliance Code:unknown
ECCN代码:EAR99Factory Lead Time:31 weeks
风险等级:5.7配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏源导通电阻:0.054 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PBGA-B4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:GRID ARRAY
极性/信道类型:P-CHANNEL表面贴装:YES
端子形式:BALL端子位置:BOTTOM
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SI8489EDB-T2-E1 数据手册

 浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第2页浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第3页浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第4页浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第5页浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第6页浏览型号SI8489EDB-T2-E1的Datasheet PDF文件第7页 
Si8489EDB  
Vishay Siliconix  
www.vishay.com  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) (Ω) MAX.  
0.044 at VGS = -10 V  
0.054 at VGS = -4.5 V  
0.082 at VGS = -2.5 V  
ID (A) a, e Qg (TYP.)  
• Small 1 mm x 1 mm max. outline area  
• Low 0.548 mm max. profile  
-5.4  
-20  
-4.9  
-3.9  
9.5 nC  
• Typical ESD protection 2500 V HBM  
• Material categorization: for definitions of  
MICRO FOOT® 1 x 1  
compliance please see www.vishay.com/doc?99912  
S
2
S
S
3
APPLICATIONS  
• Load switches and charger switches  
• Battery management  
xxxx  
xxx  
1
G
• For smart phones and tablet PCs  
G
4
1
D
Backside View  
Bump Side View  
Marking Code: xxxx = 8489  
xxx = Date / lot traceability code  
Ordering Information:  
Si8489EDB-T2-E1 (lead (Pb)-free and halogen-free)  
D
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
12  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
-5.4 a  
-4.3 a  
-3.6 b  
-2.8 b  
-20  
-1.5 a  
-0.65 b  
1.8 a  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 300 μs)  
IDM  
IS  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
1.1 a  
0.78 b  
0.5 b  
Maximum Power Dissipation  
PD  
W
Operating Junction and Storage Temperature Range  
Package Reflow Conditions c  
TJ, Tstg  
-55 to 150  
260  
VPR  
°C  
IR/Convection  
260  
Notes  
a. Surface mounted on 1" x 1" FR4 board with full copper, t = 10 s.  
b. Surface mounted on 1" x 1" FR4 board with minimum copper, t = 10 s.  
c. Refer to IPC/JEDEC® (J-STD-020), no manual or hand soldering.  
d. In this document, any reference to case represents the body of the MICRO FOOT device and foot is the bump.  
e. Based on TA = 25 °C.  
S15-1510-Rev. B, 29-Jun-15  
Document Number: 62752  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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