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SGC201BS_15 PDF预览

SGC201BS_15

更新时间: 2024-11-14 01:26:03
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 206K
描述
Surface Mount Schottky Rectifier Reverse Voltage 100V Forward Current 20A

SGC201BS_15 数据手册

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SGC201BS  
Surface Mount Schottky Rectifier  
Reverse Voltage 100V Forward Current 20A  
Features  
• Heatsink design  
• Schottky barrier diodes  
eSGC (TO277)  
• Low forward voltage drop  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
• Low profile - typical height of 1.1 mm  
• High temperature soldering guaranteed: 260℃/10 seconds  
Anode 1  
Cathode  
& Heatsink  
Anode 2  
• Halogen-free according to IEC 61249-2-21 definition  
Typical Applications  
For low voltage high frequency inverters, DC/DC converters and polarity protection application.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
SGC201BS  
Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
100  
70  
VRRM  
VRMS  
VDC  
IF(AV)1)  
IF(AV)2)  
V
V
V
Maximum DC blocking voltage  
100  
10.0  
20.0  
Maximum average forward rectified current  
A
Peak forward surge current 8.3 ms single  
half sine-wave superimposed on rated load  
250  
IFSM  
A
Operating junction and storage temperature  
range  
-55 to +150  
TJ, TSTG  
°C  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
TYP.  
MAX.  
Unit  
Parameter  
Test Conditions  
Symbol  
IF=2A  
0.42  
-
VF  
Instantaneous forward voltage  
TA=25℃  
Volts  
IF=20A  
0.62  
0.75  
250  
30  
-
-
uA  
mA  
TA=25℃  
TA=100℃  
Instantaneous reverse current at rated DC  
blocking voltage  
IR  
VR=100V  
Typical junction capacitance  
4.0 V, 1 MHz  
CJ  
1.8  
75  
1
nF  
1)  
juntion to ambient  
juntion to mount  
℃/W  
RθJA  
Typical thermal resistance  
2)  
℃/W  
RθJM  
Notes,1)Thermal resistance RθJA is junction to ambient. Free air,mounted on P.C.B with recommended copper pad area,2 OZ,FR4  
2)Thermal resistance RθJM is junction to mount.Mounted on P.C.B with 30*30mm copper pad area  
www.goodark.com  
1/4  
2015.04-Rev.B  

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