生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | HVBCC, | 针数: | 60 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.83 | JESD-30 代码: | S-PBCC-B60 |
长度: | 5 mm | 端子数量: | 60 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVBCC |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
认证状态: | Not Qualified | 座面最大高度: | 0.6 mm |
最大供电电压: | 1.95 V | 最小供电电压: | 1.65 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BUTT | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 5 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SDIO101IHE,515 | NXP |
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SDIO101IHE |
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SDIO101IHR | NXP |
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IC SPECIALTY MICROPROCESSOR CIRCUIT, PQCC60, 5 X 5 MM, 0.50 MM PITCH, PLASTIC, SOT1133-1, |
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SDIP30 | STMICROELECTRONICS |
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SDIP30 Thermal Data |
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SDIP-38L | STMICROELECTRONICS |
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IGBT intelligent power module (IPM) 14 A, 600 V, DBC isolated SDIP-38L molded |
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SDI-RX |
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Typical L-xASI/SDI-Rx/Tx Application |
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|
SDIT30 | ETC |
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DIGITAL INSUL RESISTANCE TESTER |
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SDIT300 | ETC |
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DIGITAL INSUL RESISTANCE TESTER |
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SDI-TX |
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Typical L-xASI/SDI-Rx/Tx Application |
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|
SD-J | CUI |
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STANDARD DIN CONNECTOR |
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SDJ1 | ETC |
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Thermal Cut-Offs |
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