Datasheet > SBR2A30P1

SBR2A30P1

更新时间： 2024-09-15 04:05:39

品牌	Logo	应用领域
美台 - DIODES		/
页数	文件大小	规格书
4页	304K
描述
2.0A SBR Surface Mount Super Barrier Rectifier

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中文翻译

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数据手册

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SBR2A30P1 数据手册

SPICE MODEL: SBR2A30P1

SBR2A30P1

2.0A SBR^®

Surface Mount Super Barrier Rectifier

PowerDI™123

Features

Mechanical Data

•

Case: PowerDI™123

•

Low Forward Voltage Drop

Low Leakage Current

Case Material: Molded Plastic, “Green” Molding

compound. UL Flammability Classification Rating

94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Polarity Indicator: Cathode Band

Terminals: Finish - Matte Tin annealed over

Copper leadframe. Solderable per MIL-STD-202,

Method 208

Marking Information: See Page 4

Ordering Information: See Page 4

Superior Reverse Avalanche Capability

Excellent High Temperature Stability

Patented Interlocking Clip Design for High Surge Current

Capacity

Patented Super Barrier Rectifier Technology

Soft, Fast Switching Capability

150ºC Operating Junction Temperature

±16KV ESD Protection (HBM, 3B)

±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)

Lead Free Finish, RoHS Compliant (Note 1)

“Green” Molding Compound (No Br, Sb)

Qualified to AEC-Q 101 Standards for High Reliability

•

Maximum Ratings @ T_A= 25ºC unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Characteristic

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

V_RRM

V_RWM

V_RM

RMS Reverse Voltage

V_R(RMS)

I_O

Average Rectified Output Current (See Figure 1)

2.0

Non-Repetitive Peak Forward Surge Current 8.3ms

Single Half Sine-Wave Superimposed on Rated Load

I_FSM

Maximum Thermal Resistance

R_ӨJS

R_ӨJA

R_ӨjA

175

100

Thermal Resistance Junction to Soldering (Note 2)

Thermal Resistance Junction to Ambient (Note 3)

Thermal Resistance Junction to Ambient (Note 4)

°C/W

ºC

Operating and Storage Temperature Range

T_J, T_STG

-65 to +150

Notes:

1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.

2. Theoretical R_ӨJScalculated from the top center of the die straight down to the PCB cathode tab solder junction.

3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

__________

SBR is a registered trademark of Diodes Incorporated.

PowerDI is a trademark of Diodes Incorporated.

SBR2A30P1 Rev. 8 - 2

1 of 4

www.diodes.com

January 2007

12 3 4

中文翻译

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