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SBR2U30P1 PDF预览

SBR2U30P1

更新时间: 2024-11-06 02:57:47
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美台 - DIODES /
页数 文件大小 规格书
4页 320K
描述
2.0A SBR Super Barrier Rectifier

SBR2U30P1 数据手册

 浏览型号SBR2U30P1的Datasheet PDF文件第2页浏览型号SBR2U30P1的Datasheet PDF文件第3页浏览型号SBR2U30P1的Datasheet PDF文件第4页 
SBR2U30P1  
2.0A SBR®  
Super Barrier Rectifier  
PowerDI™123  
Features  
Mechanical Data  
Case: PowerDI™123  
Ultra Low Forward Voltage Drop  
Superior Reverse Avalanche Capability  
Patented Interlocking Clip Design for  
High Surge Current Capacity  
Patented Super Barrier Rectifier Technology  
Soft, Fast Switching Capability  
150ºC Operating Junction Temperature  
±16KV ESD Protection (HBM, 3B)  
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)  
Lead Free Finish, RoHS Compliant (Note 1)  
“Green” Molding Compound (No Br, Sb)  
Qualified to AEC-Q 101 Standards for High Reliability  
Case Material: Molded Plastic, “Green” Molding  
compound. UL Flammability Classification Rating  
94V-0  
Moisture Sensitivity: Level 1 per J-STD-020C  
Polarity Indicator: Cathode Band  
Terminals: Matte Tin Finish annealed over  
Copper leadframe. Solderable per MIL-STD-202,  
Method 208  
Marking Information: See Page 4  
Ordering Information: See Page 4  
Maximum Ratings @ TA = 25ºC unless otherwise specified  
Single phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
Characteristic  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
VRRM  
VRWM  
VRM  
30  
V
RMS Reverse Voltage  
VR(RMS)  
IO  
21  
V
A
Average Rectified Output Current (See Figure 1)  
2.0  
Non-Repetitive Peak Forward Surge Current 8.3ms  
Single Half Sine-Wave Superimposed on Rated Load  
IFSM  
EAS  
75  
A
mJ  
W
Non-Repetitive Avalanche Energy  
(TJ = 25°C, IAS = 5A, L = 8.5 mH)  
105  
Repetitive Peak Avalanche Energy  
(TP = 1µs, Tj = 25°C)  
PARM  
1100  
Maximum Thermal Resistance  
Thermal Resistance Junction to Soldering (Note 2)  
Thermal Resistance Junction to Ambient (Note 3)  
Thermal Resistance Junction to Ambient (Note 4)  
RӨJS  
RӨJA  
5
178  
123  
°C/W  
ºC  
Operating and Storage Temperature Range  
TJ, TSTG  
-65 to +150  
Notes:  
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.  
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.  
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.  
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf  
__________  
SBR is a registered trademark of Diodes Incorporated.  
PowerDI is a trademark of Diodes Incorporated.  
SBR2U30P1 Rev. 4 - 2  
1 of 4  
www.diodes.com  
January 2007  
© Diodes Incorporated  

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