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SBAW56LT1 PDF预览

SBAW56LT1

更新时间: 2024-01-10 23:11:12
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管
页数 文件大小 规格书
4页 127K
描述
0.2A, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, CASE 318-08, TO-236, 3 PIN

SBAW56LT1 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT-23包装说明:TO-236, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.70
Factory Lead Time:1 week风险等级:1.02
配置:COMMON ANODE, 2 ELEMENTS二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):0.715 V
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值正向电流:4 A元件数量:2
端子数量:3最高工作温度:150 °C
最低工作温度:-55 °C最大输出电流:0.1 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
最大功率耗散:0.225 W参考标准:AEC-Q101
最大重复峰值反向电压:70 V最大反向恢复时间:0.006 µs
子类别:Rectifier Diodes表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SBAW56LT1 数据手册

 浏览型号SBAW56LT1的Datasheet PDF文件第2页浏览型号SBAW56LT1的Datasheet PDF文件第3页浏览型号SBAW56LT1的Datasheet PDF文件第4页 
BAW56TT1G,  
SBAW56TT1G  
Dual Switching Diode  
Features  
AECQ101 Qualified and PPAP Capable  
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
http://onsemi.com  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant*  
CASE 463  
SC75/SOT416  
STYLE 4  
MAXIMUM RATINGS (T = 25C)  
A
CATHODE  
Rating  
Symbol  
Max  
70  
Unit  
Vdc  
1
3
Reverse Voltage  
Forward Current  
V
I
R
2
ANODE  
200  
500  
mAdc  
mAdc  
CATHODE  
F
Peak Forward Surge Current  
THERMAL CHARACTERISTICS  
Characteristic  
I
FM(surge)  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
A1 M G  
Total Device Dissipation,  
P
D
G
FR4 Board (Note 1), T = 25C  
225  
1.8  
mW  
A
Derated above 25C  
mW/C  
1
Thermal Resistance, JunctiontoAmbient  
(Note 1)  
R
555  
C/W  
JA  
A1 = Specific Device Code  
M
G
= Date Code*  
= PbFree Package  
Total Device Dissipation,  
P
D
FR4 Board (Note 2), T = 25C  
360  
2.9  
mW  
mW/C  
A
Derated above 25C  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending upon  
manufacturing location.  
Thermal Resistance, JunctiontoAmbient  
R
345  
C/W  
C  
JA  
(Note 2)  
Junction and Storage  
Temperature Range  
T , T  
J
55 to +150  
stg  
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR4 @ Minimum Pad  
Device  
Package  
Shipping  
BAW56TT1G  
SC75/SOT416  
(PbFree)  
3,000 /  
Tape & Reel  
SBAW56TT1G  
SC75/SOT416  
(PbFree)  
3,000 /  
2. FR4 @ 1.0 1.0 Inch Pad  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
November, 2011 Rev. 4  
BAW56TT1/D  
 

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