RClamp3331Y
Ultra Small RailClamp®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - RailClamp®
Features
Description
RailClamp® TVS diodes are ultra low capacitance devices
designed to protect sensitive electronics from damage
or latch-up due to ESD, EFT, and EOS. They are designed
for use on high speed ports in applications such as cell
phones, notebook computers, and other portable elec-
tronics. These devices offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degrada-
tion.
High ESD withstand Voltage: +/-18kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per
IEC 61000-4-2 Level 4
Ultra-small 0201 package
Protects one high speed data line
Working voltage: +/- 3.3V
Low capacitance: 0.35pF typical
Extremely low dynamic resistance: 0.27 Ohms (Typ)
Low ESD clamping voltage
RClamp®3331Y features extremely good ESD protection
characteristics including a low typical dynamic resistance
of 0.27 Ohms, low peak ESD clamping voltage, and high
ESD withstand voltage (+/-18kV contact per IEC 61000-
4-2). Low typical capacitance (0.35pF at VR=0V) allows
the RClamp3331Z to be used in applications operating
in excess of 5GHz without appreciable signal attenua-
tion. Each device will protect one high speed data line
operating at 3.3 Volts.
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP0603P2X3E Package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking Code
Packaging: Tape and Reel
RClamp3331Y is in a 2-pin SLP0603P2X3E package
measuring 0.6 x 0.3 mm with a nominal height of
0.25mm. Leads are finished with lead-free NiAu. The
small package gives the designer the flexibility to
protect single lines in applications where arrays are not
practical. The combination of low peak ESD clamping,
low dynamic resistance, and low capacitance makes
this device suitable for applications such as USB 3.0,
MIPI and V-By-One interfaces in portable devices.
Applications
USB 2.0 / USB 3.0
MIPI / MDDI
V-By-One
eDP
MHL
LVDS
Nominal Dimensions
Schematic
0.600
0.220
0.300
1
0.160
0.355 BSC
2
0.250
Nominal Dimensions (in mm)
SLP0603P2X3E (Bottom View)
www.semtech.com
Revision 10/22/2013
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