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RCLAMP3344T PDF预览

RCLAMP3344T

更新时间: 2024-09-29 01:16:43
品牌 Logo 应用领域
商升特 - SEMTECH /
页数 文件大小 规格书
9页 374K
描述
Low Voltage RailClamp® 4-Line ESD Protection

RCLAMP3344T 数据手册

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RClamp3344T  
Low Voltage RailClamp®  
4-Line ESD Protection  
PROTECTION PRODUCTS - RailClamp®  
Features  
Description  
RClamp®3344T is a low voltage RailClamp which can  
provide ESD protection to IEC 61000-4-2 on high-  
speed ports. It is manufactured using Semtech's  
proprietary low voltage technology, designed to mini-  
mize both the ESD peak clamping and TLP clamping  
voltage. These devices “snap-back” to a low on-state  
voltage when the breakdown voltage of the device is  
exceeded. This has the advantage of lowering the  
overall ESD clamping voltage. When the device is in  
the on-state, the dynamic resistance is typically 0.30  
Ohms, further minimizing the ESD clamping. Maximum  
capacitance is only 0.35pF allowing the RClamp3344T  
to be used in applications operating in excess of 6GHz  
without appreciable signal attenuation. Each device  
will protect four lines operating at 3.3 volts.  
‹ High ESD withstand Voltage: +/-17kV (Contact),  
+/-20kV (Air) per IEC 61000-4-2  
‹ Package design optimized for high speed lines  
‹ Protects four high-speed lines  
‹ Flow-Through design  
‹ Low capacitance: 0.35pF Maximum  
‹ Dynamic Resistance: 0.30 Ohms Typical  
‹ Low ESD clamping voltage  
‹ Operating voltage: 3.3V  
‹ Solid-state silicon-avalanche technology  
Mechanical Characteristics  
‹ SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm)  
‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant  
‹ Lead finish: NiPdAu  
‹ Marking: Marking Code  
‹ Packaging: Tape and Reel  
RClamp3344T is in a 5-pin SLP1308N5T package. It  
measures 1.3 x 0.8mm with a nominal height of 0.40mm.  
The innovative flow through package design simplifies  
pcb layout and allows matched trace lengths for  
consistant impedance between high speed differential  
lines.  
Applications  
‹ USB 3.0  
‹ V-By-One  
The combination of low peak ESD clamping, low dynamic  
resistance, and innovative package design enables this ‹ LVDS  
device to provide the highest level of ESD protection for  
applications such as USB 3.0, MIPI/MDDI, and LVDS  
lines.  
‹ MIPI/MDDI  
‹ MyDP  
Dimensions  
Schematic & PIN Configuration  
1.30  
0.45 BSC  
1
2
0.80  
0.50 BSC  
1
3
4
5
2
0.40  
Nominal Dimensions (mm)  
4-Line, Bidirectional  
www.semtech.com  
Revision 04/24/2014  
1

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