Datasheet > RCLAMP3346P.TNT

RCLAMP3346P.TNT

更新时间： 2024-11-17 01:16:27

品牌	Logo	应用领域
商升特 - SEMTECH		/
页数	文件大小	规格书
9页	283K
描述
Low Capacitance RClamp 6-Line ESD protection

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RCLAMP3346P.TNT 数据手册

RClamp3346P

Low Capacitance RClamp^®

6-Line ESD protection

PRELIMINARY

PROTECTION PRODUCTS - RailClamp^®

Features

Description

The RClamp^®3346P provides ESD protection for high-

speed data interfaces. It features a high maximum

ESD withstand voltage of ±17kV contact and ±20kV

air discharge per IEC 61000-4-2. RClamp3346P is

designed to minimize both the ESD peak clamping and

the TLP clamping. Package inductance is reduced at

each pin resulting in lower peak ESD clamping voltage.

The dynamic resistance is among the industry’s lowest

at 0.15 Ohms (typical). Maximum capacitance on each

line to ground is 0.65pF allowing the RClamp3346P to

be used in applications operating in excess of 5GHz

without signal attenuation. Each device will protect up

to six lines (three high-speed pairs).

 ESD protection for high-speed data lines to

IEC 61000-4-2 (ESD) ±20kV (air), ±17kV (contact)

IEC 61000-4-5 (Lightning) 5A (8/20μs)

IEC 61000-4-4 (EFT) 40A (5/50ns)

 Package design optimized for high speed lines

 Flow-Through design

 Protects six high-speed lines

 Low capacitance: 0.65pF Maximum (I/O to Ground)

 Low ESD clamping voltage

 Low dynamic resistance: 0.15 Ohms (Typ)

 Qualified to AEC-Q100

 Solid-state silicon-avalanche technology

The RClamp3346P is in a 7-pin SGP2708N7 package

measuring 2.7 x 0.8mm with a nominal height of 0.50mm.

The leads have a nominal pin-to-pin pitch of 0.40mm.

Flow- through package design simplifies PCB layout and

maintains signal integrity on high-speed lines.

Mechanical Characteristics

 SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm)

 Pb-Free, Halogen Free, RoHS/WEEE Compliant

 Lead Pitch: 0.4mm (intra-pair)

 Lead finish: NiPdAu

 Marking: Marking Code

The combination of low peak ESD clamping, low dynamic

resistance, and innovative package design enables this

device to provide the highest level of ESD protection for  Packaging: Tape and Reel

applications such as USB 3.0, eSATA, and DisplayPort.

Applications

 USB 3.0

 eSATA

 Display Port

 LVDS

Dimensions

Circuit Diagram

0.80 BSC

0.40 BSC

0.80

Pin 1

Pin 3

Pin 4

Pin 5

Pin 6

Pin 7

2.70

Pin 2

0.50

Nominal Dimensions in mm (Bottom View)

6-Line Protection

www.semtech.com

Revision 11/12/2013

12 3 4 5 6 7...9

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