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RClamp3331ZATFT PDF预览

RClamp3331ZATFT

更新时间: 2024-09-29 01:16:43
品牌 Logo 应用领域
商升特 - SEMTECH /
页数 文件大小 规格书
8页 703K
描述
Ultra Small RailClamp® 1-Line, 3.3V ESD Protection

RClamp3331ZATFT 数据手册

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RClamp3331ZA  
Ultra Small RailClamp®  
1-Line, 3.3V ESD Protection  
PROTECTION PRODUCTS - RailClamp®  
Features  
Description  
RailClamp® TVS diodes are ultra low capacitance devices  
designed to protect sensitive electronics from damage  
or latch-up due to ESD, EFT, and EOS. They are designed  
for use on high speed ports in applications such as cell  
phones, notebook computers, and other portable elec-  
tronics. These devices offer desirable characteristics for  
board level protection including fast response time, low  
operating and clamping voltage, and no device degrada-  
tion.  
‹ High ESD withstand Voltage: +/-18kV (Contact/Air)  
per IEC 61000-4-2  
‹ Able to withstand over 1000 ESD strikes per  
IEC 61000-4-2 Level 4  
‹ Ultra-small 0201 package  
‹ Protects one high speed data line  
‹ Working voltage: +/- 3.3V  
‹ Low capacitance: 0.35pF typical  
‹ Extremely low dynamic resistance: 0.20 Ohms (Typ)  
‹ Low ESD clamping voltage  
RClamp®3331ZA features extremely good ESD protec-  
tion characteristics including a low typical dynamic resis-  
tance of 0.20 Ohms, low peak ESD clamping voltage,  
and high ESD withstand voltage (+/-18kV contact per  
IEC 61000-4-2). Low typical capacitance (0.35pF at  
VR=0V) allows the RClamp3331ZA to be used in applica-  
tions operating in excess of 5GHz without appreciable  
signal attenuation. Each device will protect one high  
speed data line operating at 3.3 Volts.  
‹ Solid-state silicon-avalanche technology  
Mechanical Characteristics  
‹ SLP0603P2X3F Package  
‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant  
‹ Nominal Dimensions: 0.6 x 0.3 x 0.25 mm  
‹ Lead Finish: NiAu  
‹ Marking: Marking Code  
‹ Packaging: Tape and Reel  
RClamp3331ZA is in a 2-pin SLP0603P2X3F package  
measuring 0.6 x 0.3 mm with a nominal height of  
0.25mm. Leads are finished with lead-free NiAu. The  
small package gives the designer the flexibility to  
protect single lines in applications where arrays are not  
practical. The combination of low peak ESD clamping,  
low dynamic resistance, and low capacitance makes  
this device suitable for applications such as USB 3.0,  
MIPI and V-By-One interfaces in portable devices.  
Applications  
‹ USB 2.0 / USB 3.0  
‹ MIPI / MDDI  
‹ V-By-One  
‹ eDP  
‹ MHL  
‹ LVDS  
Nominal Dimensions  
Schematic  
0.600  
0.220  
0.300  
1
0.160  
0.355 BSC  
2
0.250  
Nominal Dimensions (in mm)  
SLP0603P2X3F (Bottom View)  
www.semtech.com  
Revision 3/23/2015  
1

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