RB751V-40
200mW, Low VF SMD Schottky Barrier Diode
Small Signal Diode
SOD-323
Features
Low power loss, high current capability, low VF
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Unit (mm)
Unit (inch)
Min Max
0.047 0.055
Dimensions
Min
1.20
2.50
0.25
1.60
0.80
0.08
Max
Mechanical Data
Case : SOD-323 small outline plastic package
A
B
C
D
E
F
1.40
2.80 0.098 0.106
0.35 0.010 0.014
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Polarity : Indicated by cathode band
Weight :0.004 gram (approximately)
Marking Code : 5
1.80
0.90
0.15
0.063 0.071
0.031 0.035
0.003 0.006
0.19 REF
G
0.475 REF
Pin Configuration
Ordering Information
Marking
Package
Part No.
Packing
Suggested PAD Layout
5
5
SOD-323 RB751V-40 RR
3K / 7" Reel
0.63
0.025
SOD-323 RB751V-40 RRG 3K / 7" Reel
0.83
0.033
1.60
0.063
2.86
0.113
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Symbol
PD
Value
200
Units
mW
V
Power Dissipation
Repetitive Peak Reverse Voltage
Reverse Voltage
VRRM
VR
40
30
V
Mean Forward Current @ TL=100°C (Lead Temperature)
Non-Repetitive Peak Forward Surge Current (Note 1)
Thermal Resistance (Junction to Ambient) (Note 2)
Junction and Storage Temperature Range
IO
30
mA
A
IFSM
0.2
RθJA
TJ, TSTG
500
°C/W
°C
-45~125
Notes:1. Test Condition : 8.3ms Single half Sine-Wave Superimposed on Rated Load (JEDEC Method)
Notes:2. Valid provided that electrodes are kept at ambient temperature
Version : B10