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PHP8N20E PDF预览

PHP8N20E

更新时间: 2024-10-31 22:24:59
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管
页数 文件大小 规格书
7页 61K
描述
PowerMOS transistor

PHP8N20E 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.92
其他特性:FAST SWITCHING雪崩能效等级(Eas):250 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):9.2 A
最大漏极电流 (ID):9.2 A最大漏源导通电阻:0.4 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):80 pF
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:90 W最大功率耗散 (Abs):90 W
最大脉冲漏极电流 (IDM):37 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):180 ns最大开启时间(吨):90 ns

PHP8N20E 数据手册

 浏览型号PHP8N20E的Datasheet PDF文件第2页浏览型号PHP8N20E的Datasheet PDF文件第3页浏览型号PHP8N20E的Datasheet PDF文件第4页浏览型号PHP8N20E的Datasheet PDF文件第5页浏览型号PHP8N20E的Datasheet PDF文件第6页浏览型号PHP8N20E的Datasheet PDF文件第7页 
Philips Semiconductors  
Product specification  
PowerMOS transistor  
PHP8N20E  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
N-channel enhancement mode  
field-effect power transistor in a  
plastic envelope featuring high  
avalanche energy capability, stable  
blocking voltage, fast switching and  
high thermal cycling performance  
withlowthermalresistance. Intended  
for use in Switched Mode Power  
Supplies (SMPS), motor control  
circuits and general purpose  
switching applications.  
SYMBOL  
PARAMETER  
MAX.  
UNIT  
VDS  
ID  
Drain-source voltage  
Drain current (DC)  
Total power dissipation  
Drain-source on-state resistance  
200  
9.2  
90  
V
A
W
Ptot  
RDS(ON)  
0.4  
PINNING - TO220AB  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
d
tab  
gate  
2
drain  
g
3
source  
tab drain  
1 2 3  
s
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
ID  
Continuous drain current  
Tmb = 25 ˚C; VGS = 10 V  
Tmb = 100 ˚C; VGS = 10 V  
Tmb = 25 ˚C  
-
-
-
-
-
-
-
9.2  
6.5  
37  
A
A
IDM  
PD  
Pulsed drain current  
Total dissipation  
A
Tmb = 25 ˚C  
90  
W
PD/Tmb Linear derating factor  
Tmb > 25 ˚C  
0.6  
± 30  
250  
W/K  
V
VGS  
EAS  
Gate-source voltage  
Single pulse avalanche  
energy  
V
DD 50 V; starting Tj = 25˚C; RGS = 50 ;  
VGS = 10 V  
DD 50 V; starting Tj = 25˚C; RGS = 50 ;  
VGS = 10 V  
mJ  
IAS  
Peak avalanche current  
V
-
9.2  
A
Tj, Tstg  
Operating junction and  
storage temperature range  
- 55  
175  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Rth j-a  
Thermal resistance junction to  
-
-
-
1.67  
-
K/W  
K/W  
mounting base  
Thermal resistance junction to  
ambient  
60  
February 1997  
1
Rev 1.000  

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