5秒后页面跳转
捷配首页

Datasheet > OMAPL137BZKBT3
OMAPL137BZKBT3 PDF预览

OMAPL137BZKBT3

更新时间： 2024-01-20 07:13:11
品牌 Logo 应用领域
德州仪器 - TI 时钟外围集成电路
页数 文件大小 规格书
223页 1314K
描述
OMAP-L137 Low-Power Applications Processor

阅读下载

中文翻译

获取价格

OMAPL137BZKBT3 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：BGA
包装说明：BGA, BGA256,16X16,40针数：256
Reach Compliance Code：compliantECCN代码：3A001.A.3
HTS代码：8542.31.00.01Factory Lead Time：1 week
风险等级：8.43其他特性：IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY
地址总线宽度：13桶式移位器：NO
边界扫描：YES最大时钟频率：375 MHz
外部数据总线宽度：16格式：FLOATING POINT
内部总线架构：MULTIPLEJESD-30 代码：S-PBGA-B256
JESD-609代码：e1长度：17 mm
低功率模式：YES湿度敏感等级：3
端子数量：256最高工作温度：125 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：BGA封装等效代码：BGA256,16X16,40
封装形状：SQUARE封装形式：GRID ARRAY
峰值回流温度（摄氏度）：260电源：1.2,1.8/3.3 V
认证状态：Not Qualified座面最大高度：2.05 mm
子类别：Other Microprocessor ICs最大供电电压：1.32 V
最小供电电压：1.14 V标称供电电压：1.2 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：1 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：17 mmuPs/uCs/外围集成电路类型：DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches：1

OMAPL137BZKBT3 数据手册

 浏览型号OMAPL137BZKBT3的Datasheet PDF文件第2页浏览型号OMAPL137BZKBT3的Datasheet PDF文件第3页浏览型号OMAPL137BZKBT3的Datasheet PDF文件第4页浏览型号OMAPL137BZKBT3的Datasheet PDF文件第5页浏览型号OMAPL137BZKBT3的Datasheet PDF文件第6页浏览型号OMAPL137BZKBT3的Datasheet PDF文件第7页 
Sample &  
Buy  
Support &  
Community  
Product  
Folder  
Tools &  
Software  
Technical  
Documents  
OMAP-L137  
www.ti.com  
SPRS563F –SEPTEMBER 2008–REVISED FEBRUARY 2013  
OMAP-L137 Low-Power Applications Processor  
Check for Samples: OMAP-L137  
1 OMAP-L137 Low-Power Applications Processor  
1.1 Features  
1234  
– 8K-Byte RAM (Vector Table)  
• Highlights  
– 64K-Byte ROM  
– Dual Core SoC  
• C674x Instruction Set Features  
•
•
375/456-MHz ARM926EJ-S™ RISC MPU  
375/456-MHz C674x VLIW DSP  
– Superset of the C67x+™ and C64x+™ ISAs  
– Up to 3648/2736 C674x MIPS/MFLOPS  
– Byte-Addressable (8-/16-/32-/64-Bit Data)  
– 8-Bit Overflow Protection  
– TMS320C674x Fixed/Floating-Point VLIW  
DSP Core  
– Enhanced Direct-Memory-Access Controller  
3 (EDMA3)  
– Bit-Field Extract, Set, Clear  
– 128K-Byte RAM Shared Memory  
– Two External Memory Interfaces  
– Normalization, Saturation, Bit-Counting  
– Compact 16-Bit Instructions  
– Three Configurable 16550 type UART  
Modules  
– LCD Controller  
• C674x Two Level Cache Memory Architecture  
– 32K-Byte L1P Program RAM/Cache  
– 32K-Byte L1D Data RAM/Cache  
– Two Serial Peripheral Interfaces (SPI)  
– Multimedia Card (MMC)/Secure Digital (SD)  
– Two Master/Slave Inter-Integrated Circuit  
– One Host-Port Interface (HPI)  
– 256K-Byte L2 Unified Mapped RAM/Cache  
– Flexible RAM/Cache Partition (L1 and L2)  
• Enhanced Direct-Memory-Access Controller 3  
(EDMA3):  
– USB 1.1 OHCI (Host) With Integrated PHY  
(USB1)  
• Applications  
– 2 Transfer Controllers  
– 32 Independent DMA Channels  
– 8 Quick DMA Channels  
– Industrial Diagnostics  
– Test and measurement  
– Military Sonar/ Radar  
– Programmable Transfer Burst Size  
• TMS320C674x Fixed/Floating-Point VLIW DSP  
Core  
– Medical measurement  
– Professional Audio  
– Load-Store Architecture With Non-Aligned  
Support  
• Software Support  
– 64 General-Purpose Registers (32 Bit)  
– Six ALU (32-/40-Bit) Functional Units  
– TI DSP/BIOS™  
– Chip Support Library and DSP Library  
• Dual Core SoC  
– 375/456-MHz ARM926EJ-S™ RISC MPU  
– 375/456-MHz C674x VLIW DSP  
• ARM926EJ-S Core  
•
Supports 32-Bit Integer, SP (IEEE Single  
Precision/32-Bit) and DP (IEEE Double  
Precision/64-Bit) Floating Point  
Supports up to Four SP Additions Per  
Clock, Four DP Additions Every 2 Clocks  
Supports up to Two Floating Point (SP or  
DP) Reciprocal Approximation (RCPxP)  
and Square-Root Reciprocal  
Approximation (RSQRxP) Operations Per  
Cycle  
•
•
– 32-Bit and 16-Bit (Thumb®) Instructions  
– DSP Instruction Extensions  
– Single Cycle MAC  
– ARM™ Jazelle® Technology  
– EmbeddedICE-RT™ for Real-Time Debug  
• ARM9 Memory Architecture  
– 16K-Byte Instruction Cache  
– 16K-Byte Data Cache  
– Two Multiply Functional Units  
•
Mixed-Precision IEEE Floating Point  
Multiply Supported up to:  
–
–
2 SP x SP -> SP Per Clock  
2 SP x SP -> DP Every Two Clocks  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
DSP/BIOS, TMS320C6000, C6000 are trademarks of Texas Instruments.  
ARM926EJ-S, ETM9, CoreSight are trademarks of ARM Limited.  
All other trademarks are the property of their respective owners.  
2
3
4
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2008–2013, Texas Instruments Incorporated  
 
 
1234567...223

中文翻译

下载PDF

OMAPL137BZKBT3 替代型号

型号 品牌 替代类型 描述 数据表
OMAPL137DZKBT3 TI

完全替代

 OMAP-L137 Low-Power Applications Processor

与OMAPL137BZKBT3相关器件

型号 品牌 获取价格 描述 数据表
OMAPL137DZKB3 TI

获取价格

 		OMAP-L137 Low-Power Applications Processor
OMAPL137DZKB4 TI

获取价格

 		OMAP-L137 Low-Power Applications Processor
OMAPL137DZKBA3 TI

获取价格

 		OMAP-L137 Low-Power Applications Processor
OMAPL137DZKBD4 TI

获取价格

 		OMAP-L137 Low-Power Applications Processor
OMAPL137DZKBT3 TI

获取价格

 		OMAP-L137 Low-Power Applications Processor
OMAPL137-HT TI

获取价格

 		Multimedia Device Engineering Sample ES1.0 ES1.1 Version A
OMAPL137ZKB3 TI

获取价格

 		Low-Power Applications Processor
OMAP-L138 TI

获取价格

 		OMAP-L138 Low-Power Applications Processor
OMAP-L138_0908 TI

获取价格

 		OMAP-L138 Low-Power Applications Processor
OMAP-L138_10 TI

获取价格

 		Low-Power Applications Processor

与OMAPL137BZKBT3相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证