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OMAPL138BZCED4 PDF预览

OMAPL138BZCED4

更新时间: 2024-01-15 20:20:40
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
287页 1875K
描述
OMAP-L138 C6-Integra DSP+ARM Processor

OMAPL138BZCED4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA, BGA361,19X19,25针数:361
Reach Compliance Code:compliantECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.82
地址总线宽度:桶式移位器:NO
边界扫描:YES最大时钟频率:50 MHz
外部数据总线宽度:格式:FLOATING POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B361
JESD-609代码:e1长度:13 mm
低功率模式:YES湿度敏感等级:3
端子数量:361封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA361,19X19,25
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.2,1.8/3.3 V
认证状态:Not Qualified座面最大高度:1.3 mm
子类别:Other uPs/uCs/Peripheral ICs最大供电电压:1.35 V
最小供电电压:0.95 V标称供电电压:1 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.65 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:13 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches:1

OMAPL138BZCED4 数据手册

 浏览型号OMAPL138BZCED4的Datasheet PDF文件第2页浏览型号OMAPL138BZCED4的Datasheet PDF文件第3页浏览型号OMAPL138BZCED4的Datasheet PDF文件第4页浏览型号OMAPL138BZCED4的Datasheet PDF文件第5页浏览型号OMAPL138BZCED4的Datasheet PDF文件第6页浏览型号OMAPL138BZCED4的Datasheet PDF文件第7页 
OMAP-L138  
www.ti.com  
SPRS586CJUNE 2009REVISED MAY 2011  
OMAP-L138 C6-IntegraDSP+ARM® Processor  
Check for Samples: OMAP-L138  
1 OMAP-L138 C6-IntegraDSP+ARM® Processor  
1.1 Features  
12  
Normalization, Saturation, Bit-Counting  
Highlights  
Compact 16-Bit Instructions  
Dual Core SoC  
C674x Two Level Cache Memory Architecture  
32K-Byte L1P Program RAM/Cache  
32K-Byte L1D Data RAM/Cache  
375/456-MHz ARM926EJ-SRISC MPU  
375/456-MHz C674x Fixed/Floating-Point  
VLIW DSP  
Enhanced Direct-Memory-Access Controller  
256K-Byte L2 Unified Mapped RAM/Cache  
Flexible RAM/Cache Partition (L1 and L2)  
(EDMA3)  
Serial ATA (SATA) Controller  
Enhanced Direct-Memory-Access Controller 3  
DDR2/Mobile DDR Memory Controller  
(EDMA3):  
Two Multimedia Card (MMC)/Secure Digital  
2 Channel Controllers  
(SD) Card Interface  
3 Transfer Controllers  
LCD Controller  
Video Port Interface (VPIF)  
64 Independent DMA Channels  
16 Quick DMA Channels  
10/100 Mb/s Ethernet MAC (EMAC)  
Programmable Real-Time Unit Subsystem  
Three Configurable UART Modules  
USB 1.1 OHCI (Host) With Integrated PHY  
USB 2.0 OTG Port With Integrated PHY  
One Multichannel Audio Serial Port  
Two Multichannel Buffered Serial Ports  
Dual Core SoC  
375/456-MHz ARM926EJ-SRISC MPU  
375/456-MHz C674x Fixed/Floating-Point  
VLIW DSP  
ARM926EJ-S Core  
Programmable Transfer Burst Size  
TMS320C674x Floating-Point VLIW DSP Core  
Load-Store Architecture With Non-Aligned  
Support  
64 General-Purpose Registers (32 Bit)  
Six ALU (32-/40-Bit) Functional Units  
Supports 32-Bit Integer, SP (IEEE Single  
Precision/32-Bit) and DP (IEEE Double  
Precision/64-Bit) Floating Point  
Supports up to Four SP Additions Per  
Clock, Four DP Additions Every 2 Clocks  
Supports up to Two Floating Point (SP or  
DP) Reciprocal Approximation (RCPxP)  
and Square-Root Reciprocal  
32-Bit and 16-Bit (Thumb®) Instructions  
DSP Instruction Extensions  
Single Cycle MAC  
Approximation (RSQRxP) Operations Per  
Cycle  
ARM® Jazelle® Technology  
EmbeddedICE-RTfor Real-Time Debug  
ARM9 Memory Architecture  
16K-Byte Instruction Cache  
16K-Byte Data Cache  
Two Multiply Functional Units  
Mixed-Precision IEEE Floating Point  
Multiply Supported up to:  
2 SP x SP SP Per Clock  
2 SP x SP DP Every Two Clocks  
2 SP x DP DP Every Three Clocks  
2 DP x DP DP Every Four Clocks  
8K-Byte RAM (Vector Table)  
64K-Byte ROM  
C674xInstruction Set Features  
Superset of the C67x+and C64x+ISAs  
Up to 3648/2746 C674x MIPS/MFLOPS  
Byte-Addressable (8-/16-/32-/64-Bit Data)  
8-Bit Overflow Protection  
Fixed Point Multiply Supports Two 32 x  
32-Bit Multiplies, Four 16 x 16-Bit  
Multiplies, or Eight 8 x 8-Bit Multiplies per  
Clock Cycle, and Complex Multiples  
Instruction Packing Reduces Code Size  
All Instructions Conditional  
Hardware Support for Modulo Loop  
Bit-Field Extract, Set, Clear  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2011, Texas Instruments Incorporated  
 
 

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