NTGS3446
Power MOSFET
5.1 Amps, 20 Volts
N−Channel TSOP−6
Features
• Ultra Low R
DS(on)
http://onsemi.com
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
V
R
TYP
I MAX
D
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
(BR)DSS
DS(on)
20 V
36 mW @ 4.5 V
5.1 A
• I
Specified at Elevated Temperature
DSS
• Pb−Free Package Option for Green Manufacturing (G Suffix)
Applications
N−Channel
Drain 1 2 5 6
• Power Management in portable and battery−powered products, i.e.
computers, printers, PCMCIA cards, cellular and cordless
• Lithium Ion Battery Applications
• Notebook PC
Gate 3
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol Value
Unit
V
Source
4
V
DSS
20
MARKING
DIAGRAM
V
GS
±12
V
Thermal Resistance
4
5
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T = 25°C
Drain Current
R
P
244
0.5
°C/W
Watts
q
JA
d
6
A
TSOP−6
CASE 318G
STYLE 1
446
W
− Continuous @ T = 25°C
I
2.5
10
Amps
Amps
A
D
3
− Pulsed Drain Current (t t 10 ms)
I
p
DM
2
1
Thermal Resistance
446
W
= Device Code
= Work Week
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T = 25°C
R
P
128
1.0
°C/W
Watts
q
JA
d
A
Drain Current
− Continuous @ T = 25°C
− Pulsed Drain Current (t t 10 ms)
I
3.6
14
Amps
Amps
A
D
PIN ASSIGNMENT
I
p
DM
Drain Drain Source
Thermal Resistance
6
5
4
Junction−to−Ambient (Note 3)
Total Power Dissipation @ T = 25°C
R
P
62.5
2.0
°C/W
Watts
q
JA
d
A
Drain Current
− Continuous @ T = 25°C
− Pulsed Drain Current (t t 10 ms)
I
5.1
2.0
Amps
Amps
A
D
I
p
DM
Source Current (Body Diode)
I
S
5.1
A
1
2
3
Drain Drain Gate
Operating and Storage Temperature Range
T , T
−55 to
150
°C
J
stg
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
T
L
260
°C
†
Device
Package
Shipping
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), operating to steady state.
3. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), t < 5.0 seconds.
NTGS3446T1
TSOP−6
3000/Tape & Reel
3000/Tape & Reel
TSOP−6
(Pb−Free)
NTGS3446T1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
November, 2003 − Rev. 3
NTGS3446/D