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NTGS3446 PDF预览

NTGS3446

更新时间: 2024-10-02 03:45:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 48K
描述
Power MOSFET 5.1 Amps, 20 Volts N−Channel TSOP−6

NTGS3446 数据手册

 浏览型号NTGS3446的Datasheet PDF文件第2页浏览型号NTGS3446的Datasheet PDF文件第3页浏览型号NTGS3446的Datasheet PDF文件第4页 
NTGS3446  
Power MOSFET  
5.1 Amps, 20 Volts  
N−Channel TSOP−6  
Features  
Ultra Low R  
DS(on)  
http://onsemi.com  
Higher Efficiency Extending Battery Life  
Logic Level Gate Drive  
V
R
TYP  
I MAX  
D
Diode Exhibits High Speed, Soft Recovery  
Avalanche Energy Specified  
(BR)DSS  
DS(on)  
20 V  
36 mW @ 4.5 V  
5.1 A  
I  
Specified at Elevated Temperature  
DSS  
Pb−Free Package Option for Green Manufacturing (G Suffix)  
Applications  
N−Channel  
Drain 1 2 5 6  
Power Management in portable and battery−powered products, i.e.  
computers, printers, PCMCIA cards, cellular and cordless  
Lithium Ion Battery Applications  
Notebook PC  
Gate 3  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
Symbol Value  
Unit  
V
Source  
4
V
DSS  
20  
MARKING  
DIAGRAM  
V
GS  
±12  
V
Thermal Resistance  
4
5
Junction−to−Ambient (Note 1)  
Total Power Dissipation @ T = 25°C  
Drain Current  
R
P
244  
0.5  
°C/W  
Watts  
q
JA  
d
6
A
TSOP−6  
CASE 318G  
STYLE 1  
446  
W
− Continuous @ T = 25°C  
I
2.5  
10  
Amps  
Amps  
A
D
3
− Pulsed Drain Current (t t 10 ms)  
I
p
DM  
2
1
Thermal Resistance  
446  
W
= Device Code  
= Work Week  
Junction−to−Ambient (Note 2)  
Total Power Dissipation @ T = 25°C  
R
P
128  
1.0  
°C/W  
Watts  
q
JA  
d
A
Drain Current  
− Continuous @ T = 25°C  
− Pulsed Drain Current (t t 10 ms)  
I
3.6  
14  
Amps  
Amps  
A
D
PIN ASSIGNMENT  
I
p
DM  
Drain Drain Source  
Thermal Resistance  
6
5
4
Junction−to−Ambient (Note 3)  
Total Power Dissipation @ T = 25°C  
R
P
62.5  
2.0  
°C/W  
Watts  
q
JA  
d
A
Drain Current  
− Continuous @ T = 25°C  
− Pulsed Drain Current (t t 10 ms)  
I
5.1  
2.0  
Amps  
Amps  
A
D
I
p
DM  
Source Current (Body Diode)  
I
S
5.1  
A
1
2
3
Drain Drain Gate  
Operating and Storage Temperature Range  
T , T  
55 to  
150  
°C  
J
stg  
ORDERING INFORMATION  
Maximum Lead Temperature for Soldering  
Purposes for 10 seconds  
T
L
260  
°C  
Device  
Package  
Shipping  
1. Minimum FR−4 or G−10PCB, operating to steady state.  
2. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick  
single−sided), operating to steady state.  
3. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick  
single−sided), t < 5.0 seconds.  
NTGS3446T1  
TSOP−6  
3000/Tape & Reel  
3000/Tape & Reel  
TSOP−6  
(Pb−Free)  
NTGS3446T1G  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
November, 2003 − Rev. 3  
NTGS3446/D  
 

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