NTD95N02R
Power MOSFET
95 Amps, 24 Volts
N−Channel DPAK
Features
http://onsemi.com
• High Power and Current Handling Capability
• Fast Switching Performance
V
R
TYP
I MAX*
D
(BR)DSS
DS(ON)
4.5 mW @ 10 V
5.9 mW @ 4.5 V
• Low R
to Minimize Conduction Loss
DS(on)
24 V
95 A
• Low Gate Charge to Minimize Switching Losses
• Pb−Free Packages are Available
*I MAX in the product summary table is continuous
and steady at 25°C.
D
Applications
D
• CPU Motherboard Vcore Applications
• High Frequency DC−DC Converters
• Motor Drives
G
• Bridge Circuits
S
MAXIMUM RATINGS (T = 25°C unless otherwise specified)
J
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
V
24
20
DSS
Gate−to−Source Voltage
V
V
GS
4
Drain
Thermal Resistance, Junction−to−Case
R
P
1.45
86
°C/W
q
JC
Total Power Dissipation @ T = 25°C
W
A
D
Drain Current –
4
DPAK
− Continuous @ T = 25°C, Limited by Package
I
I
95
32
A
A
A
D
D
CASE 369AA
(Surface Mount)
STYLE 2
− Continuous @ T = 25°C, Limited by Wires
A
2
1
Thermal Resistance, Junction−to− Ambient
(Note 1)
R
52
°C/W
q
JA
3
2
− Total Power Dissipation @ T = 25°C
P
I
2.4
15.8
W
A
1
Gate
3
A
D
D
Drain
− Drain Current − Continuous @ T = 25°C
A
Source
Thermal Resistance, Junction−to−Ambient
(Note 2)
R
100
°C/W
q
JA
4
− Total Power Dissipation @ T = 25°C
P
I
1.25
12
W
A
A
D
D
Drain
− Drain Current − Continuous @ T = 25°C
A
4
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
DPAK
CASE 369D
(Straight Lead)
STYLE 2
T
STG
Continuous Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
I
45
84
A
S
1
E
mJ
AS
2
Energy – (V = 25 V, V = 10, I = 13 A,
DD
G
PK
3
L = 1 mH, R = 25 W)
G
1
2
3
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 seconds)
T
260
°C
L
Gate Drain Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
Y
WW
T95N02R
G
= Year
= Work Week
= Device Code
= Pb−Free Package
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
July, 2006 − Rev. 3
NTD95N02R/D