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NTD95N02R

更新时间: 2024-09-15 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 67K
描述
Power MOSFET 95 Amps, 24 Volts N−Channel DPAK

NTD95N02R 数据手册

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NTD95N02R  
Power MOSFET  
95 Amps, 24 Volts  
N−Channel DPAK  
Features  
http://onsemi.com  
High Power and Current Handling Capability  
Fast Switching Performance  
V
R
TYP  
I MAX*  
D
(BR)DSS  
DS(ON)  
4.5 mW @ 10 V  
5.9 mW @ 4.5 V  
Low R  
to Minimize Conduction Loss  
DS(on)  
24 V  
95 A  
Low Gate Charge to Minimize Switching Losses  
Pb−Free Packages are Available  
*I MAX in the product summary table is continuous  
and steady at 25°C.  
D
Applications  
D
CPU Motherboard Vcore Applications  
High Frequency DC−DC Converters  
Motor Drives  
G
Bridge Circuits  
S
MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
J
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Parameter  
Drain−to−Source Voltage  
Symbol Value  
Unit  
V
V
24  
20  
DSS  
Gate−to−Source Voltage  
V
V
GS  
4
Drain  
Thermal Resistance, Junction−to−Case  
R
P
1.45  
86  
°C/W  
q
JC  
Total Power Dissipation @ T = 25°C  
W
A
D
Drain Current –  
4
DPAK  
− Continuous @ T = 25°C, Limited by Package  
I
I
95  
32  
A
A
A
D
D
CASE 369AA  
(Surface Mount)  
STYLE 2  
− Continuous @ T = 25°C, Limited by Wires  
A
2
1
Thermal Resistance, Junction−to− Ambient  
(Note 1)  
R
52  
°C/W  
q
JA  
3
2
Total Power Dissipation @ T = 25°C  
P
I
2.4  
15.8  
W
A
1
Gate  
3
A
D
D
Drain  
− Drain Current − Continuous @ T = 25°C  
A
Source  
Thermal Resistance, Junction−to−Ambient  
(Note 2)  
R
100  
°C/W  
q
JA  
4
Total Power Dissipation @ T = 25°C  
P
I
1.25  
12  
W
A
A
D
D
Drain  
− Drain Current − Continuous @ T = 25°C  
A
4
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
DPAK  
CASE 369D  
(Straight Lead)  
STYLE 2  
T
STG  
Continuous Source Current (Body Diode)  
Single Pulse Drain−to−Source Avalanche  
I
45  
84  
A
S
1
E
mJ  
AS  
2
Energy – (V = 25 V, V = 10, I = 13 A,  
DD  
G
PK  
3
L = 1 mH, R = 25 W)  
G
1
2
3
Lead Temperature for Soldering Purposes  
(1/8 in from case for 10 seconds)  
T
260  
°C  
L
Gate Drain Source  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[1 oz] including traces).  
Y
WW  
T95N02R  
G
= Year  
= Work Week  
= Device Code  
= Pb−Free Package  
2. Surface mounted on FR4 board using the minimum recommended pad size  
(Cu area = 0.412 in sq).  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
July, 2006 − Rev. 3  
NTD95N02R/D  
 

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