0201/0402/0603 Chip Inductors
NIS Series
FEATURES
• LASER CUT SPIRAL COIL OVER ALUMINA CORE
• SUPER MINIATURE EIA 0201, 0402 & 0603 SIZE IN RESIN ENCLOSED BODY
• HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS
• TIGHT TOLERANCES (D ± 0.3nH, G ± 2% or J ± 5%)
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
RoHS
SPECIFICATIONS
Compliant
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includes all homogeneous materials
*See Part Number System for Details
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ENVIRONMENTAL CHARACTERISTICS
Test
Specification
Test Method & Condition
After 3 Sec. Dip in +230oC Solder Pot (Post Flux)
After 500 Hrs at 60oC and 90-95% RH (No Load)
After 10 Seconds at +260oC (5 Min, 120oC
Pre-Heat)
After 2 Hrs per Axis, 10~55Hz, 1.5mm Amplitude
After 100 Cycles (-40o to +85oC) 30 Min. Each
After 500 Hrs at -40oC
Solderability
90% Min. Coverage
Humidity Resistance
(1) No Evidence of Damage
(2) Inductance Shall Be
Within + 5% of Initial
Value
(3) Q Factor Shall Be Within
±20% of Initial Value
(±25% for 0201 size)
Soldering Effect
Low Frequency Vibration
Thermal Shock
Low Temperature Storage
(1) No Evidence of Damage
(2) Inductance Shall Be
Within + 10% of Initial
Value
(3) Q Factor Shall Be Within
±20% of Initial Value
High Temperature Load
Life
After 500 Hrs at 85oC with Rated DC Current
After 500 Hrs at 60oC with 90-95%RH
with Rated DC Current
Humidity Load Life
PART AND LAND PATTERN DIMENSIONS (mm)
PART NUMBER SYSTEM
NIS04 J 22N TR F
Series
L
W
H
t
A
B
C
Pb-free/RoHS compliant
Packaging: TR = Tape & Reel
Inductance Code (N=decimal point)
(Ex. 2N2=2.2nH, 33N=33nH)
NIS02 0.6 +0.05 0.3 +0.05 0.3 +0.05 0.15 +0.05 0.26~0.30 0.75~0.80 0.28~0.35
NIS04 1.0 +0.05 0.5 +0.05 0.5 +0.05 0.2 +0.1 0.5~0.6
NIS06 1.6 +0.15 0.8 +0.15 0.8 +0.15 0.3 +0.2 0.8~1.0
Recommended land patterns for flow and reflow soldering
1.5~1.7
2.0~2.6
0.5~0.6
0.7~0.9
Tolerance Code (D=±0.3nH, G=±2%, J=±5%)
Series (02=0201, 04=0402, 06=0603)
DIMENSION (mm)
Solder Plated Terminations
Land Pattern
Resin Enclosure
NIS Chip
C
H
t
A
W
L
B
®
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