是否无铅: | 不含铅 | 生命周期: | End Of Life |
包装说明: | WLCSP-12 | Reach Compliance Code: | compliant |
Factory Lead Time: | 1 week | 风险等级: | 6.72 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PBGA-B12 | 长度: | 2.025 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 12 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA12,3X4,16 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 0.6 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.2 mA | 最大供电电压 (Vsup): | 28 V |
最小供电电压 (Vsup): | 2.8 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 宽度: | 1.285 mm |
Base Number Matches: | 1 |
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