是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | HVSON, SOLCC6,.08,25 | Reach Compliance Code: | compliant |
Factory Lead Time: | 5 weeks | 风险等级: | 1.47 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-PDSO-N6 | 长度: | 2 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装等效代码: | SOLCC6,.08,25 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.55 mm |
最大供电电流 (Isup): | 0.066 mA | 最大供电电压 (Vsup): | 28 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子形式: | NO LEAD |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2 mm |
Base Number Matches: | 1 |
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