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NCP398MUTBG PDF预览

NCP398MUTBG

更新时间: 2024-11-09 01:14:59
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管
页数 文件大小 规格书
12页 686K
描述
USB Type-C VCONN Overvoltage Protection IC

NCP398MUTBG 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:HVSON, SOLCC6,.08,25Reach Compliance Code:compliant
Factory Lead Time:5 weeks风险等级:1.47
可调阈值:NO模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码:S-PDSO-N6长度:2 mm
信道数量:1功能数量:1
端子数量:6最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC6,.08,25
封装形状:SQUARE封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:0.55 mm
最大供电电流 (Isup):0.066 mA最大供电电压 (Vsup):28 V
标称供电电压 (Vsup):5 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:2 mm
Base Number Matches:1

NCP398MUTBG 数据手册

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NCP398  
USB Type-C VCONN  
Overvoltage Protection IC  
The NCP398 is an overvoltage protection device. It protects  
VCONN against overvoltages in applications where VCONN is  
directly derived from the VBUS supply.  
At power up, the integrated power MOSFET is automatically  
controlled to reduce inrush current. The IC continuously monitors  
undervoltage, overvoltage and thermal events. In case of  
overvoltage, a very high speed comparator opens the power  
MOSFET instantaneously.  
www.onsemi.com  
MARKING  
DIAGRAMS  
The part is enabled through the EN pin. A high level on this pin  
allows forcing off the internal switch and drastically decreases the  
current consumption of the NCP398 core.  
AV MG  
UDFN6  
CASE 517AB  
G
Features  
AV  
M
G
= Specific Device Code  
= Date Code  
= Pb−Free Package  
Over−voltage Protection up to + 28 V  
On−chip Low R  
NMOS Transistors: Typical 200 mW  
dson  
(Note: Microdot may be in either location)  
Over−voltage Lockout (OVLO)  
Shutdown EN Input  
AA  
AYW  
Output Discharge Path  
WLCSP4  
CASE 567MN  
WLCSP4 Package 0.84 x 0.84 mm, 0.4p  
UDFN6 Package 2 x 2 mm, 0.65p  
These Parts are ROHS Devices  
AA  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
W
= Work Week  
Typical Applications  
Type−C USB  
Smartphones  
Tablets  
PIN CONNECTIONS  
IN  
1
2
3
OUT  
OUT  
EN  
6
5
4
IN  
GND  
UDFN  
OUT  
IN  
EN  
GND  
WLCSP  
(Top Views)  
Figure 1. Typical Application Circuit  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 11 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
August, 2016 − Rev. 1  
NCP398/D  

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