是否无铅: | 含铅 | 生命周期: | Contact Manufacturer |
零件包装代码: | DFN | 包装说明: | 3 X 3 MM, DFN-10 |
针数: | 10 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.82 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-XDSO-N10 |
JESD-609代码: | e0 | 长度: | 3 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 10 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | UNSPECIFIED | |
封装代码: | HVSON | 封装等效代码: | SOLCC10,.12,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
子类别: | Power Management Circuits | 最大供电电压 (Vsup): | 6.5 V |
最小供电电压 (Vsup): | 2.8 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn90Pb10) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3 mm |
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