是否无铅: | 不含铅 | 生命周期: | Obsolete |
零件包装代码: | DFN | 包装说明: | 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, DFN-10 |
针数: | 10 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 5.14 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-XDSO-N10 | JESD-609代码: | e3 |
长度: | 3 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 10 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | HVSON |
封装等效代码: | SOLCC10,.12,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 子类别: | Power Management Circuits |
最大供电电压 (Vsup): | 6.5 V | 最小供电电压 (Vsup): | 2.8 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | COMMERCIAL | 端子面层: | Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3 mm | Base Number Matches: | 1 |
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