是否无铅: | 不含铅 | 生命周期: | End Of Life |
包装说明: | VFBGA, | 针数: | 25 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.68 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | S-PBGA-B25 |
长度: | 2.06 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 25 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.6 mm |
最大供电电压 (Vsup): | 7 V | 最小供电电压 (Vsup): | 3.6 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2.06 mm |
Base Number Matches: | 1 |
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