是否无铅: | 不含铅 | 生命周期: | End Of Life |
包装说明: | VFBGA, BGA25,5X5,16 | 针数: | 25 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.66 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | R-PBGA-B25 |
长度: | 2.55 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 25 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA25,5X5,16 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 3.6/28 V |
认证状态: | Not Qualified | 座面最大高度: | 0.6 mm |
子类别: | Power Management Circuits | 最大供电电压 (Vsup): | 7.3 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 宽度: | 2.2 mm |
Base Number Matches: | 1 |
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