Datasheet > NCP1392DDR2G

NCP1392DDR2G

更新时间： 2024-09-20 01:12:03

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
21页	203K
描述
High-Voltage Half-Bridge Driver with Inbuiltc Oscillator

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NCP1392DDR2G 数据手册

NCP1392B, NCP1392D

High-Voltage Half-Bridge

Driver with Inbuilt

Oscillator

The NCP1392B/D is a self−oscillating high voltage MOSFET

driver primarily tailored for the applications using half bridge

topology. Due to its proprietary high−voltage technology, the driver

accepts bulk voltages up to 600 V. Operating frequency of the driver

can be adjusted from 25 kHz to 480 kHz using a single resistor.

Adjustable Brown−out protection assures correct bulk voltage

operating range. An internal 100 ms or 12.6 ms PFC delay timer

guarantee that the main downstream converter will be turned on in the

time the bulk voltage is fully stabilized. The device provides fixed

dead time which helps lowering the shoot−through current.

http://onsemi.com

MARKING

DIAGRAMS

1392x

SOIC−8

CASE 751

ALYWW

Features

1392x = Specific Device Code

x = B or D

• Wide Operating Frequency Range − from 25 kHz to 480 kHz

• Minimum frequency adjust accuracy $3%

• Fixed Dead Time − 0.6 ms or 0.3 ms

• Adjustable Brown−out Protection for a Simple PFC Association

• 100 ms or 12.6 ms PFC Delay Timer

• Non−latched Enable Input

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

PINOUT DIAGRAM

• Internal 16 V V Clamp

• Low Startup Current of 50 mA

• 1 A / 0.5 A Peak Current Sink / Source Drive Capability

• Operation up to 600 V Bulk Voltage

• Internal Temperature Shutdown

• SOIC−8 Package

Vboot

VCC

Mupper

GND

Mlower

• These are Pb−Free Devices

Typical Applications

ORDERING INFORMATION

• Flat Panel Display Power Converters

• Low Cost Resonant SMPS

• High Power AC/DC Adapters for Notebooks

• Offline Battery Chargers

†

Device

Package

Shipping

NCP1392BDR2G

SOIC−8

2500 /

(Pb−Free)

Tape & Reel

NCP1392DDR2G

SOIC−8

2500 /

• Lamp Ballasts

(Pb−Free)

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2012

Publication Order Number:

May, 2012 − Rev. 3

NCP1392/D

12 3 4 5 6 7...21

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