Datasheet > MV7654

MV7654

更新时间： 2024-09-17 20:05:31

品牌	Logo	应用领域
美高森美 - MICROSEMI		超快恢复二极管快速恢复二极管
页数	文件大小	规格书
3页	76K
描述
Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, HERMETIC SEALED, GLASS PACKAGE-2

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MV7654 技术参数

生命周期：	Active	包装说明：	O-LALF-W2
针数：	2	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8541.10.00.80
风险等级：	5.76	其他特性：	HIGH RELIABILITY
应用：	ULTRA FAST RECOVERY	外壳连接：	ISOLATED
配置：	SINGLE	二极管元件材料：	SILICON
二极管类型：	RECTIFIER DIODE	JESD-30 代码：	O-LALF-W2
最大非重复峰值正向电流：	125 A	元件数量：	1
相数：	1	端子数量：	2
最高工作温度：	175 °C	最低工作温度：	-65 °C
最大输出电流：	3 A	封装主体材料：	GLASS
封装形状：	ROUND	封装形式：	LONG FORM
认证状态：	Not Qualified	最大重复峰值反向电压：	150 V
最大反向恢复时间：	0.03 µs	表面贴装：	NO
端子形式：	WIRE	端子位置：	AXIAL
Base Number Matches：	1

MV7654 数据手册

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841

1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803

Website: http://www.microsemi.com

VOIDLESS - HERMETICALLY- SEALED

ULTRAFAST RECOVERY GLASS RECTIFIERS

Reference MIL-PRF-19500/477

DEVICES

LEVELS

MV7654

TXV

Bare copper lead version of 1N5811

Equivalent

DESCRIPTION

This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and

is ideal for high-reliability applications where a failure cannot be tolerated. These industry-

recognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are

hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical

bond. These devices are available in both leaded and surface mount MELF package

configurations. Microsemi also offers numerous other rectifier products to meet higher and

lower current ratings with various recovery time speed requirements including standard, fast and

ultrafast device types in both through-hole and surface mount packages.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

B-Body

Leaded Package

¾ Voidless hermetically sealed glass package

¾ Extremely robust construction

¾ Internal “Category I” Metallurgical bonds

MAXIMUM RATINGS

¾ Junction Temperature: -65^oC to +175^oC

¾ Storage Temperature: -65^oC to +175^oC

¾ Average Rectified Forward Current (I_O): 6 A @ T_L= 75ºC at 3/8 inch lead length (see

note 1)

¾ Thermal Resistance: 22 ºC/W junction to lead (L=.375 in)

¾ Thermal Impedance: 1.5 ºC/W @ 10 ms heating time

¾ Forward Surge Current (8.3 ms half sine) 125 Amps

¾ Capacitance: 60 pF at 10 volts, f = 1 MHz

¾ Solder temperature: 260ºC for 10 s (maximum)

MECHANICAL AND PACKAGING

¾ CASE: Hermetically sealed voidless hard glass with Tungsten slugs

¾ TERMINATIONS: Axial-leads are Bare Copper.

¾ MARKING: Body painted and part number, etc.

¾ POLARITY: Cathode indicated by band

¾ Tape & Reel option: Standard per EIA-296

¾ Weight: 750 mg

¾ See package dimensions on last page

T4-LDS-0169 Rev. 1 (101075)

Page 1 of 3

12 3

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