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MUN5316DW1T1 PDF预览

MUN5316DW1T1

更新时间: 2024-10-29 04:38:39
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描述
Dual Bias Resistor Transistors

MUN5316DW1T1 数据手册

 浏览型号MUN5316DW1T1的Datasheet PDF文件第2页浏览型号MUN5316DW1T1的Datasheet PDF文件第3页浏览型号MUN5316DW1T1的Datasheet PDF文件第4页浏览型号MUN5316DW1T1的Datasheet PDF文件第5页浏览型号MUN5316DW1T1的Datasheet PDF文件第6页浏览型号MUN5316DW1T1的Datasheet PDF文件第7页 
Dual Bias Resistor Transistors  
NPN and PNP Silicon Surface Mount  
Transistors with Monolithic Bias  
Resistor Network  
MUN5311DW1T1  
Series  
6
5
4
The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network  
consisting of two resistors; a series base resistor and a base–emitter resistor. These digital tran-  
sistors are designed to replace a single device and its external resistor bias network. The BRT  
eliminates these individual components by integrating them into a single device. In the  
MUN5311DW1T1 series, two complementary BRT devices are housed in the SOT–363 package  
which is ideal for low power surface mount applications where board space is at a premium.  
• Simplifies Circuit Design  
1
2
3
SOT 363  
CASE 419B STYLE1  
• Reduces Board Space  
• Reduces Component Count  
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel  
MAXIMUM RATINGS (T A = 25°C unless otherwise noted, common for Q 1  
6
5
4
and Q 2 , – minus sign for Q 1 (PNP) omitted)  
R1  
R2  
Rating  
Symbol Value  
Unit  
Vdc  
Q2  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
V CBO  
V CEO  
I C  
50  
50  
R2  
Q1  
Vdc  
R1  
100  
mAdc  
1
2
3
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
(One Junction Heated)  
Total Device Dissipation  
T A = 25°C  
Symbol  
Max  
Unit  
6
5
4
P D  
187 (Note 1.)  
256 (Note 2.)  
1.5 (Note 1.)  
2.0 (Note 2.)  
670 (Note 1.)  
490 (Note 2.)  
mW  
XX  
Derate above 25°C  
mW/°C  
°C/W  
1
2
3
Thermal Resistance –  
Junction-to-Ambient  
R θJA  
xx = Device Marking  
= (See Page 2)  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
DEVICE MARKING  
INFORMATION  
See specific marking information in  
the device marking table on page 2 of  
this data sheet.  
Total Device Dissipation  
T A = 25°C  
P D  
250 (Note 1.)  
385 (Note 2.)  
2.0 (Note 1.)  
3.0 (Note 2.)  
mW  
Derate above 25°C  
mW/°C  
°C/W  
Thermal Resistance –  
Junction-to-Ambient  
Thermal Resistance –  
Junction-to-Lead  
R θJA  
R θJL  
493 (Note 1.)  
325 (Note 2.)  
188 (Note 1.)  
208 (Note 2.)  
°C/W  
Junction and Storage  
Temperature  
T J , T stg  
–55 to +150  
°C  
1. FR–4 @ Minimum Pad  
2. FR–4 @ 1.0 x 1.0 inch Pad  
MUN5311dw–1/13  

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