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MTE30N50E PDF预览

MTE30N50E

更新时间: 2024-09-17 22:29:47
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摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
8页 231K
描述
TMOS POWER FET 30 AMPERES 500 VOLTS RDS(on) = 0.150 OHM

MTE30N50E 数据手册

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Order this document  
by MTE30N50E/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
30 AMPERES  
500 VOLTS  
This advanced TMOS E–FET is designed to withstand high  
energy in the avalanche mode and switch efficiently. This new  
energy design also offers a drain–to–source diode with fast  
recovery time. Designed for high voltage, high speed switching  
applications in power supplies, PWM motor controls, and other  
inductive loads. The avalanche energy capability is specified to  
eliminate the guesswork in designs where inductive loads are  
switched and offer additional safety margin against unexpected  
voltage transients.  
R
= 0.150 OHM  
DS(on)  
4
1
3
2500 V RMS Isolated ISOTOP Package  
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable to a Discrete  
Fast Recovery Diode  
2
D
Diode is Characterized for Use in Bridge Circuits  
Very Low Internal Parasitic Inductance  
G
I
and V  
Specified at Elevated Temperature  
SOT–227B  
DSS  
DS(on)  
U.L. Recognized, File #E69369  
S
1. Source  
2. Gate  
3. Drain  
4. Source 2  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
Unit  
Drain–to–Source Voltage  
V
500  
500  
Vdc  
DSS  
Drain–to–Gate Voltage (R  
GS  
= 1.0 M)  
V
DGR  
Vdc  
Gate–to–Source Voltage — Continuous  
— Non–Repetitive (t 10 ms)  
V
± 20  
± 40  
Vdc  
Vpk  
GS  
V
GSM  
p
Drain Current — Continuous @ 25°C  
Drain Current — Continuous @ 100°C  
I
I
30  
12  
80  
Adc  
Apk  
D
D
Drain Current — Single Pulse (t 10 µs)  
I
p
DM  
Total Power Dissipation @ 25°C  
Derate above 25°C  
P
D
250  
2.0  
Watts  
W/°C  
Operating and Storage Temperature Range  
T , T  
J stg  
55 to 150  
°C  
Single Pulse Drain–to–Source Avalanche Energy – Starting T = 25°C  
E
AS  
mJ  
J
(V  
DD  
= 100 Vdc, V = 10 Vdc, Peak I = 30 Apk, L = 10 mH, R = 25 )  
GS L G  
3000  
Thermal Resistance — Junction to Case  
Thermal Resistance — Junction to Ambient  
R
R
0.5  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
E–FET is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
ISOTOP is a trademark of SGS–THOMSON Microelectronics.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Motorola, Inc. 1996  

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