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MTD3055VT4 PDF预览

MTD3055VT4

更新时间: 2024-11-08 22:45:51
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
12页 85K
描述
Power MOSFET 12Amps, 60 Volts

MTD3055VT4 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.09
Is Samacsys:N雪崩能效等级(Eas):72 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):12 A
最大漏极电流 (ID):12 A最大漏源导通电阻:0.15 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e0湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):48 W
最大脉冲漏极电流 (IDM):37 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

MTD3055VT4 数据手册

 浏览型号MTD3055VT4的Datasheet PDF文件第2页浏览型号MTD3055VT4的Datasheet PDF文件第3页浏览型号MTD3055VT4的Datasheet PDF文件第4页浏览型号MTD3055VT4的Datasheet PDF文件第5页浏览型号MTD3055VT4的Datasheet PDF文件第6页浏览型号MTD3055VT4的Datasheet PDF文件第7页 
MTD3055V  
Preferred Device  
Power MOSFET  
12 Amps, 60 Volts  
N–Channel DPAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. Designed for low voltage, high  
speed switching applications in power supplies, converters and power  
motor controls, these devices are particularly well suited for bridge  
circuits where diode speed and commutating safe operating areas are  
critical and offer additional safety margin against unexpected voltage  
transients.  
http://onsemi.com  
12 AMPERES  
60 VOLTS  
R
= 150 m  
DS(on)  
Avalanche Energy Specified  
I  
and V Specified at Elevated Temperature  
DSS  
DS(on)  
N–Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Drain–Source Voltage  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
V
DSS  
Drain–Gate Voltage (R  
= 1.0 M)  
V
DGR  
60  
G
GS  
Gate–Source Voltage  
– Continuous  
V
± 20  
± 25  
Vdc  
Vpk  
GS  
S
– Non–repetitive (t 10 ms)  
V
GSM  
p
Drain Current – Continuous @ 25°C  
Drain Current – Continuous @ 100°C  
I
12  
7.3  
37  
Adc  
MARKING  
DIAGRAM  
D
I
D
Drain Current – Single Pulse (t 10 µs)  
I
DM  
Apk  
p
Total Power Dissipation @ 25°C  
Derate above 25°C  
P
D
48  
0.32  
1.75  
Watts  
W/°C  
Watts  
4
YWW  
T
3055V  
CASE 369A  
DPAK  
STYLE 2  
Total Power Dissipation @ T = 25°C, when  
A
2
3
1
mounted to minimum recommended pad  
size  
Operating and Storage Temperature  
Range  
T , T  
stg  
–55 to  
175  
°C  
Y
WW  
T
= Year  
= Work Week  
= MOSFET  
J
Single Pulse Drain–to–Source Avalanche  
E
AS  
72  
mJ  
Energy – Starting T = 25°C  
J
(V  
= 25 Vdc, V  
= 10 Vdc,  
GS  
PIN ASSIGNMENT  
DD  
= 12 Apk, L = 1.0 mH, R = 25 )  
I
L
4
G
Drain  
Thermal Resistance  
– Junction to Case  
– Junction to Ambient  
– Junction to Ambient, when mounted to  
minimum recommended pad size  
°C/W  
°C  
R
R
R
3.13  
100  
71.4  
θJC  
θJA  
θJA  
Maximum Temperature for Soldering  
Purposes, 1/8from case for 10  
seconds  
T
260  
L
1
Gate  
2
3
Drain Source  
ORDERING INFORMATION  
Device  
Package  
DPAK  
Shipping  
75 Units/Rail  
MTD3055V  
MTD3055V1  
MTD3055VT4  
DPAK  
75 Units/Rail  
DPAK  
2500 Tape & Reel  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev. 3  
MTD3055V/D  

MTD3055VT4 替代型号

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