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MT5C2564C-35/IT PDF预览

MT5C2564C-35/IT

更新时间: 2024-11-05 05:50:39
品牌 Logo 应用领域
AUSTIN 存储内存集成电路静态存储器
页数 文件大小 规格书
12页 90K
描述
64K x 4 SRAM SRAM MEMORY ARRAY

MT5C2564C-35/IT 技术参数

生命周期:Active零件包装代码:DIP
包装说明:0.300 INCH, CERAMIC, DIP-24针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.11
Is Samacsys:N最长访问时间:35 ns
JESD-30 代码:R-CDIP-T24内存密度:262144 bit
内存集成电路类型:STANDARD SRAM内存宽度:4
功能数量:1端子数量:24
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64KX4
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL座面最大高度:5.08 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:7.62 mm
Base Number Matches:1

MT5C2564C-35/IT 数据手册

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SRAM  
MT5C2564  
Austin Semiconductor, Inc.  
64K x 4 SRAM  
SRAM MEMORY ARRAY  
PIN ASSIGNMENT  
(Top View)  
AVAILABLE AS MILITARY  
SPECIFICATIONS  
• SMD 5962-88681  
• SMD 5962-88545  
• MIL-STD-883  
24-Pin DIP (C)  
(300 MIL)  
28-Pin LCC (EC)  
3
2 1 28 27  
FEATURES  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
1
2
3
4
5
6
7
8
9
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
Vcc  
2 6  
2 5  
2 4  
2 3  
2 2  
2 1  
2 0  
1 9  
1 8  
A15  
A14  
A13  
A12  
A11  
A10  
DQ4  
DQ3  
DQ2  
A15  
A14  
A13  
A12  
A11  
A10  
DQ4  
DQ3  
DQ2  
DQ1  
WE\  
A2  
A3  
A4  
A5  
A6  
A7  
A8 1 0  
A9 1 1  
CE\ 1 2  
4
5
6
7
8
9
• High Speed: 15, 20, 25, 35, 45, 55, and 70  
• Battery Backup: 2V data retention  
• Low power standby  
• High-performance, low-power, CMOS double-metal  
process  
• Single +5V (+10%) Power Supply  
• Easy memory expansion with CE\  
• All inputs and outputs are TTL compatible  
A9 10  
CE\ 11  
Vss 12  
13 14 15 16 17  
28-Pin Flat Pack (F)  
OPTIONS  
• Timing  
MARKING  
1
2 8  
2 7  
2 6  
2 5  
2 4  
2 3  
2 2  
2 1  
2 0  
1 9  
1 8  
1 7  
1 6  
1 5  
NC  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
CE\  
NC  
Vss  
Vcc  
2
A15  
A14  
A13  
A12  
A11  
A10  
NC  
3
15ns access  
20ns access  
25ns access  
35ns access  
45ns access  
55ns access  
70ns access  
-15  
-20  
-25  
-35  
-45  
-55*  
-70*  
4
5
6
7
8
9
NC  
1 0  
1 1  
1 2  
1 3  
1 4  
DQ3  
DQ2  
DQ1  
DQ0  
WE\  
• Package(s)  
Ceramic DIP (300 mil)  
CeramicLCC  
Ceramic Flatpack  
C
EC  
F
No. 106  
No. 204  
GENERAL DESCRIPTION  
• OperatingTemperature Ranges  
Industrial (-40oC to +85oC)  
Military (-55oC to +125oC)  
The Austin Semiconductor SRAM family employs  
high-speed, low-power CMOS and are fabricated using double-  
layer metal, double-layer polysilicon technology.  
IT  
XT  
For flexibility in high-speed memory applications,  
Austin Semiconductor offers chip enable (CE\) on all  
organizations. This enhancement can place the outputs in  
High-Z for additional flexibility in system design. The x4  
configuration features common data input and output.  
Writing to these devices is accomplished when write  
enable (WE\) and CE\ inputs are both LOW. Reading is  
accomplished when WE\ remains HIGH and CE\ goes LOW.  
The device offers a reduced power standby mode when  
disabled. This allows system designs to achieve low standby  
power requirements.  
• 2V data retention/low power  
L
*Electrical characteristics identical to those provided for the 45ns  
access devices.  
For more products and information  
please visit our web site at  
www.austinsemiconductor.com  
These devices operate from a single +5V power  
supply and all inputs and outputs are fully TTL compatible.  
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.  
MT5C2564  
Rev. 3.1 6/05  
1

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