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MT58L256L18P1T-5 PDF预览

MT58L256L18P1T-5

更新时间: 2024-02-01 22:10:15
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 静态存储器内存集成电路
页数 文件大小 规格书
31页 1131K
描述
256KX18 CACHE SRAM, 2.8ns, PQFP100, PLASTIC, MS-026, TQFP-100

MT58L256L18P1T-5 技术参数

生命周期:Transferred零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.44
Is Samacsys:N最长访问时间:3.1 ns
JESD-30 代码:R-PQFP-G100长度:20 mm
内存密度:4718592 bit内存集成电路类型:CACHE SRAM
内存宽度:18功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

MT58L256L18P1T-5 数据手册

 浏览型号MT58L256L18P1T-5的Datasheet PDF文件第1页浏览型号MT58L256L18P1T-5的Datasheet PDF文件第2页浏览型号MT58L256L18P1T-5的Datasheet PDF文件第3页浏览型号MT58L256L18P1T-5的Datasheet PDF文件第5页浏览型号MT58L256L18P1T-5的Datasheet PDF文件第6页浏览型号MT58L256L18P1T-5的Datasheet PDF文件第7页 
4Mb: 256K x 18, 128K x 32/36  
PIPELINED, SCD SYNCBURST SRAM  
GENERALDESCRIPTION(continued)  
(CE#), two additional chip enables for easy depth ex-  
pansion (CE2, CE2#), burst control inputs (ADSC#,  
ADSP#, ADV#), byte write enables (BWx#) and global  
write (GW#).  
Asynchronous inputs include the output enable  
(OE#), clock (CLK) and snooze enable (ZZ). There is  
also a burst mode input (MODE) that selects between  
interleaved and linear burst modes. The data-out (Q),  
enabled by OE#, is also asynchronous. WRITE cycles  
can be from one to two bytes wide (x18) or from one to  
four bytes wide (x32/x36), as controlled by the write  
control inputs.  
Burst operation can be initiated with either address  
status processor (ADSP#) or address status controller  
(ADSC#) inputs. Subsequent burst addresses can be  
internally generated as controlled by the burst advance  
input (ADV#).  
Address and write control are registered on-chip to  
simplify WRITE cycles. This allows self-timed WRITE  
cycles. Individual byte enables allow individual bytes  
to be written. During WRITE cycles on the x18 device,  
BWa# controls DQa pins and DQPa; BWb# controls DQb  
pins and DQPb. During WRITE cycles on the x32 and  
x36 devices, BWa# controls DQa pins and DQPa; BWb#  
controls DQb pins and DQPb; BWc# controls DQc pins  
and DQPc; BWd# controls DQd pins and DQPd. GW#  
LOW causes all bytes to be written. Parity bits are only  
available on the x18 and x36 versions.  
This device incorporates a single-cycle deselect fea-  
ture during READ cycles. If the device is immediately  
deselected after a READ cycle, the output bus goes to a  
t
High-Z state KQHZ nanoseconds after the rising edge  
of clock.  
Micron’s 4Mb SyncBurst SRAMs operate from a +3.3V  
VDD power supply, and all inputs and outputs are TTL-  
compatible. Users can choose either a 3.3V or 2.5V I/O  
version. The device is ideally suited for Pentium and  
PowerPC pipelined systems and systems that benefit  
from a very wide, high-speed data bus. The device is  
also ideal in generic 16-, 18-, 32-, 36-, 64-, and 72-bit-  
wide applications.  
Please refer to Micron’s Web site (www.micron.com/  
sramds) for the latest data sheet.  
4Mb:256Kx18, 128Kx32/36Pipelined, SCDSyncBurstSRAM  
MT58L256L18P1_F.p65 – Rev. F, Pub. 1/03 EN  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
3
©2003,MicronTechnology,Inc.  

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